Company Filing History:
Years Active: 2020
Title: Spotlight on Inventor Merve Celikkol: Innovating Multi-Chip Packaging with Inorganic Interposer
Introduction: Merve Celikkol, a talented inventor based in Chandler, AZ, has made significant contributions to the field of multi-chip packaging with his groundbreaking patent on inorganic interposer technology.
Latest Patents: Merve Celikkol holds one patent for an "Inorganic Interposer for Multi-Chip Packaging." This patent describes methods and devices for multichip packages that utilize an inorganic interposer, facilitating high-density interconnect circuitry between chips.
Career Highlights: Currently employed at Intel Corporation, Merve Celikkol continues to drive innovation in the semiconductor industry. His expertise in inorganic material applications has led to pioneering advancements in chip packaging technology.
Collaborations: Merve Celikkol collaborates with esteemed colleagues at Intel Corporation, including Daniel N Sobieski and Kristof Darmawikarta. Together, they explore new frontiers in multi-chip packaging, creating robust and high-performance solutions for the market.
Conclusion: Merve Celikkol's dedication to pushing the boundaries of multi-chip packaging through inorganic interposer technology underscores his status as a visionary inventor. His work at Intel Corporation and collaborations with industry experts reaffirm his commitment to driving innovation and shaping the future of semiconductor packaging.