Intel Corporation

Merve Celikkol

Kristof Darmawikarta

Kemal Aygun

Zhiguo Qian

Sri Ranga Sai Boyapati

Kyu Oh Lee

Daniel N Sobieski

Discussed generally herein are methods and devices for multichip packages that include an inorganic interposer. A device can include a substrate including low density interconnect circuitry therein, an inorganic interposer on the substrate, the inorganic interposer including high density interconnect circuitry electrically connected to the low density interconnect circuitry, the inorganic interposer including inorganic materials, and two or more chips electrically connected to the inorganic interposer, the two or more chips electrically connected to each other through the high density interconnect circuitry.

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Chandler, AZ, United States of America

Merve Celikkol