Hyde Park, VT, United States of America

Dale Warner Martin

USPTO Granted Patents = 22 


Average Co-Inventor Count = 3.9

ph-index = 8

Forward Citations = 436(Granted Patents)


Location History:

  • High Park, VT (US) (2003 - 2005)
  • Essex Junction, VT (US) (2007)
  • Williston, VT (US) (2007)
  • Hyde Park, VT (US) (1999 - 2016)

Company Filing History:


Years Active: 1999-2016

where 'Filed Patents' based on already Granted Patents

22 patents (USPTO):

Title: The Innovative Contributions of Dale Warner Martin

Introduction

Dale Warner Martin is a notable inventor based in Hyde Park, Vermont, recognized for his extensive contributions in the field of substrate bonding and integrated circuit technology. With an impressive portfolio of 22 patents, Martin's work has significantly advanced the way device structures are fabricated and enhanced the performance of electronic components.

Latest Patents

Among his latest patents, two stand out for their innovative approaches:

1. **Flattened Substrate Surface for Substrate Bonding** - This patent details methods for bonding substrate surfaces, resulting in bonded substrate assemblies and design structures. The invention describes how device structures are created using the first surface of a device substrate, where a wiring layer for the interconnect structure is formed and planarized. A temporary handle wafer is bonded to this planarized wiring layer, facilitating the bonding of a final handle substrate to the opposite surface of the device substrate. The removal of the temporary handle wafer completes the process.

2. **High Linearity SOI Wafer for Low-Distortion Circuit Applications** - This method involves implanting a first material on one side of a substrate to alter its crystalline structure. Following this, a second material is deposited, and an insulator layer is bonded to form integrated circuit devices on the opposite side. The unique features of this patent include maintaining the crystalline state during thermal annealing, ensuring the integrity of the circuit devices.

Career Highlights

Throughout his career, Dale Warner Martin has made substantial contributions while working at renowned companies such as IBM and Globalfoundries Inc. His work at these organizations has played an essential role in pushing the boundaries of electronic design and manufacturing processes.

Collaborations

Martin's innovations have been further enhanced through collaborations with esteemed colleagues, including Chung H. Lam and James Albert Slinkman. These professional relationships have likely contributed to the depth and breadth of his inventive contributions, fostering a collaborative environment that promotes cutting-edge advancements.

Conclusion

With 22 patents to his name, Dale Warner Martin continues to be a significant figure in the realm of electronics and materials science. His latest innovations in substrate bonding and circuit design highlight his expertise and commitment to advancing technology. As he continues his trajectory in the field, the impact of his work will undoubtedly inspire future generations of inventors and engineers.

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