Self-aligned non-volatile random access memory cell and process to make the same

Abstract

A self aligned method of forming a semiconductor memory array of floating gate memory cells in a semiconductor substrate has a plurality of spaced apart isolation regions on the substrate substantially parallel to one another. An active region is between each pair of adjacent isolation regions. The active and isolation regions are formed in parallel and in the column direction. In the row direction, strips of spaced apart silicon nitride are formed. A source line plug is formed between adjacent pairs of silicon nitride and is in contact with a first region in the active regions, and the isolation regions. The strips of silicon nitride are removed and isotropically etched. In addition, the materials beneath the silicon nitride are also isotropically etched. Polysilicon spacers are then formed in the row direction parallel to the source line plug and adjacent to the floating gates to form connected control gates. A second region is formed between adjacent, spaced apart, control gates. A bit line is formed in the bit line direction contacting the second region in the space between the control gates.