The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2007

Filed:

Oct. 01, 2004
Applicants:

Dale W. Martin, Hyde Park, VT (US);

Steven M. Shank, Jericho, VT (US);

Michael C. Triplett, Colchester, VT (US);

Deborah A. Tucker, Westford, VT (US);

Inventors:

Dale W. Martin, Hyde Park, VT (US);

Steven M. Shank, Jericho, VT (US);

Michael C. Triplett, Colchester, VT (US);

Deborah A. Tucker, Westford, VT (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/336 (2006.01); H01L 21/8238 (2006.01);
U.S. Cl.
CPC ...
Abstract

A structure and fabrication method for a gate stack used to define source/drain regions in a semiconductor substrate. The method comprises (a) forming a gate dielectric layer on top of the substrate, (b) forming a gate polysilicon layer on top of the gate dielectric layer, (c) implanting n-type dopants in a top layer of the gate polysilicon layer, (d) etching away portions of the gate polysilicon layer and the gate dielectric layer so as to form a gate stack on the substrate, and (e) thermally oxidizing side walls of the gate stack with the presence of a nitrogen-carrying gas. As a result, a diffusion barrier layer is formed at the same depth in the polysilicon material of the gate stack regardless of the doping concentration. Therefore, the n-type doped region of the gate stack has the same width as that of the undoped region of the gate stack.


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