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For the Inventor, By the Inventor

Newark, CA, United States of America

Da Li

This inventor holds 15 USPTO granted patents and 12 published patent applications. Top assignee: Lam Research Corporation. Active years: 2022-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Da Li. Retrieved from https://idiyas.com/inventor/da-li-lcqkcipn

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 15 

% Patents Active = 66.7

Average Co-Inventor Count = 7.1

ph-index = 3

Forward Citations = 66(Granted Patents)


Company Filing History:

goldMedal15 out of 3,945 
 
Lam Research Corporation
 patents

Years Active: 2022-2026

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15 patents (USPTO):Explore Patents
1. 12748352 - Control of metallic contamination from metal-containing photoresist (2026-09-29),
2. 12736874 - Apparatus and process for EUV dry resist sensitization by gas phase infusion of a sensitizer (2026-09-15),
3. 12646695 - Dry chamber clean of photoresist films (2026-06-02),
4. 12601976 - All-in-one dry development for metal-containing photoresist (2026-04-14),
5. 12586765 - Surface modification for metal-containing photoresist deposition (2026-03-24),
6. 12510826 - Photoresist development with halide chemistries (2025-12-30),
7. 12510825 - Photoresist development with halide chemistries (2025-12-30),
8. 12504692 - Cyclic development of metal oxide based photoresist for etch stop deterrence (2025-12-23),
9. 12474640 - Integration of dry development and etch processes for EUV patterning in a single process chamber (2025-11-18),
10. 12474638 - Underlayer for photoresist adhesion and dose reduction (2025-11-18),
11. 12105422 - Photoresist development with halide chemistries (2024-10-01),
12. 12062538 - Atomic layer etch and selective deposition process for extreme ultraviolet lithography resist improvement (2024-08-13),
13. 12027375 - Selective etch using a sacrificial mask (2024-07-02),
14. 11988965 - Underlayer for photoresist adhesion and dose reduction (2024-05-21),
15. 11314168 - Underlayer for photoresist adhesion and dose reduction (2022-04-26),

Title: Inspiring Innovation: Da Li's Journey in Pushing Boundaries Through Invention

Introduction: Da Li, a visionary inventor based in Newark, CA (US), has been at the forefront of pushing boundaries and redefining what is possible through his innovative creations. His relentless passion for invention continues to inspire the next generation of inventors and innovators worldwide.

Latest Patents: Da Li holds one patent titled "Underlayer for photoresist adhesion and dose reduction." This patent focuses on a patterning structure comprising an underlayer and an imaging layer, enhancing radiation absorptivity and patterning performance.

Career Highlights: Da Li is a valuable asset at Lam Research Corporation, where his inventive spirit and dedication have contributed significantly to groundbreaking technological advancements. His work reflects a deep commitment to revolutionizing the industry.

Collaborations: Da Li has collaborated closely with esteemed coworkers such as Samantha S H Tan and Jun Xue, fostering a dynamic environment of creativity and innovation. Together, they have pushed the boundaries of what is possible in the realm of invention.

Conclusion: Da Li's remarkable journey as an inventor exemplifies the power of passion and determination in driving innovation. His contributions not only impact the present technological landscape but also pave the way for a brighter future guided by endless possibilities.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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