Taichung, Taiwan

Chun-Hung Liao

USPTO Granted Patents = 24 

Average Co-Inventor Count = 5.5

ph-index = 1

Forward Citations = 2(Granted Patents)


Location History:

  • Hsinchu, TW (2014 - 2023)
  • Taichung, TW (2020 - 2024)

Company Filing History:


Years Active: 2014-2025

where 'Filed Patents' based on already Granted Patents

24 patents (USPTO):

Title: Chun-Hung Liao: Innovator in Chemical Mechanical Polishing

Introduction

Chun-Hung Liao is a notable inventor based in Taichung, Taiwan, recognized for his significant contributions to the field of chemical mechanical polishing. With an impressive portfolio of 19 patents, Liao has advanced the technology used in semiconductor manufacturing and polishing processes.

Latest Patents

Liao's latest inventions include groundbreaking methods for enhancing the performance of polishing pads utilized in chemical mechanical polishing (CMP). One of his most recent patents outlines the fabrication of a polishing pad specifically designed for CMP processes. The method involves creating an interpenetrating polymer network, which incorporates a porous top pad that maintains consistent surface roughness while polishing a workpiece. Another significant patent details a manufacturing method for semiconductors, where a ceria compound slurry is employed during the CMP operation to effectively planarize metal-dielectric surfaces.

Career Highlights

Throughout his career, Chun-Hung Liao has gained valuable experience at leading companies in the semiconductor industry, including Taiwan Semiconductor Manufacturing Company Limited and Microjet Technology Company, Limited. His work has been instrumental in driving forward innovation in semiconductor production technologies.

Collaborations

Liao has collaborated with other skilled professionals in the field, including his coworkers Chen-Hao Wu and Shen-Nan Lee. Together, they have contributed to advancements in CMP methodologies and the development of cutting-edge materials used in the polishing process.

Conclusion

Chun-Hung Liao's innovative patents and extensive experience underscore his role as a pivotal figure in the semiconductor industry. His work not only enhances the efficacy of chemical mechanical polishing but also demonstrates the ongoing evolution of technology in semiconductor manufacturing. As the industry continues to grow, Liao's contributions will undoubtedly play a vital role in shaping the future of manufacturing processes.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…