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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12024651 B1

PDFFull Text
Date of Patent:
Jul. 02, 2024

Filed:

Mar. 07, 2022

Chemical mechanical polishing slurry composition and method of polishing metal layer

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Chun-Hung Liao, Taichung, TW;

An-Hsuan Lee, Hsinchu, TW;

Shen-Nan Lee, Hsinchu County, TW;

Teng-Chun Tsai, Hsinchu, TW;

Chen-Hao Wu, Hsinchu, TW;

Huang-Lin Chao, Hillsboro, OR (US);

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Attorney:

JCIPRNET

Primary Examiner:

Jiong-Ping Lu

Int. Cl.
CPC ...
C09G 1/02 (2006.01); B24B 1/00 (2006.01); B24B 37/04 (2012.01); C09G 1/00 (2006.01); C09G 1/04 (2006.01); C09G 1/06 (2006.01); C09K 3/14 (2006.01); C09K 13/06 (2006.01); H01L 21/306 (2006.01); H01L 21/321 (2006.01); H01L 21/8238 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); B24B 1/00 (2013.01); B24B 37/044 (2013.01); C09G 1/00 (2013.01); C09G 1/04 (2013.01); C09G 1/06 (2013.01); C09K 3/1454 (2013.01); C09K 3/1463 (2013.01); C09K 13/06 (2013.01); H01L 21/30625 (2013.01); H01L 21/3212 (2013.01); H01L 21/823828 (2013.01);
Abstract

A CMP slurry composition and a method of polishing a metal layer are provided. In some embodiments, the CMP slurry composition includes about 0.1 to 10 parts by weight of a metal oxide, and about 0.1 to 10 parts by weight of a chelator. The chelator includes a thiol compound or a thiolether compound.

Find Patent Forward Citations

Liao, Chun-Hung. (2024). Chemical mechanical polishing slurry composition and method of polishing metal layer (U.S. Patent No. 12024651). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12024651

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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