Company Filing History:
Years Active: 2021-2025
Title: Innovations of An-Hsuan Lee in Chemical Mechanical Polishing
Introduction
An-Hsuan Lee is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of chemical mechanical polishing (CMP), with a total of 12 patents to his name. His work focuses on enhancing the efficiency and effectiveness of polishing processes used in semiconductor manufacturing.
Latest Patents
Among his latest patents, An-Hsuan Lee has developed a chemical mechanical polishing slurry composition and a method of polishing a metal layer. This CMP slurry composition includes about 0.1 to 10 parts by weight of a metal oxide and about 0.1 to 10 parts by weight of a chelator, which can be a thiol compound or a thiolether compound. Additionally, he has patented a method for fabricating a polishing pad for CMP processes. This method involves forming an interpenetrating polymer network with a porous top pad that maintains consistent surface roughness during the polishing of a workpiece.
Career Highlights
An-Hsuan Lee is currently employed at Taiwan Semiconductor Manufacturing Company Limited, where he continues to innovate in the field of semiconductor processing. His expertise in CMP has positioned him as a key figure in advancing polishing technologies.
Collaborations
An-Hsuan Lee has collaborated with notable colleagues, including Chun-Hung Liao and Chen-Hao Wu, who contribute to the research and development efforts in their field.
Conclusion
An-Hsuan Lee's contributions to chemical mechanical polishing have significantly impacted the semiconductor industry. His innovative patents and ongoing work at Taiwan Semiconductor Manufacturing Company Limited highlight his role as a leading inventor in this critical area of technology.