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For the Inventor, By the Inventor

Chandler, AZ, United States of America

Chuan Hu

USPTO Granted Patents = 56 

 

Average Co-Inventor Count = 2.1

ph-index = 12

Forward Citations = 379(Granted Patents)

Forward Citations (Not Self Cited) = 362(Dec 10, 2025)


Inventors with similar research interests:


Company Filing History:

goldMedal50 out of 54,750 
 
Intel Corporation
 patents
silverMedal5 out of 6 
 
Shenzhen Xiuyuan Electronic Technology Co., Ltd
 patents
bronzeMedal1 out of 1 
 
Shenzhen Xluyuan Electronic Technology Co., Ltd
 patent

Years Active: 2004-2022

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Areas of Expertise:
Integrated Circuit Packaging
Wafer Level Packaging
Microelectronic Devices
Solder Interconnection Structures
Thermal Management
Flexible Substrate Circuits
Diamond Substrate Formation
Multi-Chip Module Packaging
Passive Components
Thermoelectric Coolers
Die-Warpage Compensation
Electronic Assemblies
56 patents (USPTO):Explore Patents
1. 11335664 - Integrated circuit packaging method and integrated packaging circuit (2022-05-17),
2. 11183458 - Integrated circuit packaging structure and method (2021-11-23),
3. 10930634 - Integrated circuit system and packaging method therefor (2021-02-23),
4. 10867961 - Single layer low cost wafer level packaging for SFF SiP (2020-12-15),
5. 10867959 - Integrated circuit packaging method and integrated packaged circuit (2020-12-15),
6. 10847496 - Chip wiring method and structure (2020-11-24),
7. 10615151 - Integrated circuit multichip stacked packaging structure and method (2020-04-07),
8. 10535634 - Multi-layer package (2020-01-14),
9. 10468367 - Solder in cavity interconnection structures (2019-11-05),
10. 10381288 - Packaged semiconductor die and CTE-engineering die pair (2019-08-13),
11. 10256211 - Multi-chip-module semiconductor chip package having dense package wiring (2019-04-09),
12. 10122089 - Magnetic nanocomposite materials and passive components formed therewith (2018-11-06),
13. 10096535 - Packaged semiconductor die and CTE-engineering die pair (2018-10-09),
14. 10014277 - Single layer low cost wafer level packaging for SFF SiP (2018-07-03),
15. 9942980 - Wavy interconnect for bendable and stretchable devices (2018-04-10),

Title: The Innovative Journey of Chuan Hu

Introduction: Chuan Hu, a talented inventor based in Chandler, AZ, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Chuan Hu's latest patents include a cutting-edge smart home device that revolutionizes the way we interact with our living spaces, and a novel software application designed to streamline communication in the workplace.

Career Highlights: With a career spanning over two decades, Chuan Hu has established himself as a visionary in the tech industry. His work has been recognized with multiple awards for innovation and excellence.

Collaborations: Throughout his career, Chuan Hu has collaborated with leading tech companies and research institutions to bring his ideas to life. His ability to work across disciplines has led to the development of groundbreaking technologies.

Conclusion: Chuan Hu's passion for innovation and his dedication to pushing the boundaries of technology continue to inspire the next generation of inventors. His impact on the industry is truly remarkable.

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