Chuan Hu

This inventor holds 56 USPTO granted patents and 4 published patent applications and 2 EPO patents, primarily in Integrated Circuit Packaging (CPC class H01L). Top assignees: Intel Corporation, Shenzhen Xiuyuan Electronic Technology Co., Ltd, Shenzhen Xluyuan Electronic Technology Co., Ltd. Active years: 2004-2022.

USPTO Granted Patents = 56 (Patent Applications = 4)

% Patents Active = 51.8

EPO Patents = 2 (Patent Applications = 5)

Average Co-Inventor Count = 2.1

ph-index = 12

Forward Citations = 386(Granted Patents)

Forward Citations (Not Self Cited) = 362(Dec 10, 2025)

Inventors with similar research interests:

Company Filing History:

Shenzhen Xiuyuan Electronic Technology Co., Ltd

patents

1 out of 1

Shenzhen Xluyuan Electronic Technology Co., Ltd

patent

Years Active: 2004-2022

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Areas of Expertise:

Integrated Circuit

Packaging

Multichip Structure

Wafer-Level Packaging

Thermal Management

Solder Interconnection

Microelectronic Devices

Die-Warpage Compensation

Flexible Substrate

Semiconductor Device

Electrical Circuit

Nanocomposite Materials

56 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11335664 - Integrated circuit packaging method and integrated packaging circuit (2022-05-17),

2. 11183458 - Integrated circuit packaging structure and method (2021-11-23),

3. 10930634 - Integrated circuit system and packaging method therefor (2021-02-23),

4. 10867961 - Single layer low cost wafer level packaging for SFF SiP (2020-12-15),

5. 10867959 - Integrated circuit packaging method and integrated packaged circuit (2020-12-15),

6. 10847496 - Chip wiring method and structure (2020-11-24),

7. 10615151 - Integrated circuit multichip stacked packaging structure and method (2020-04-07),

8. 10535634 - Multi-layer package (2020-01-14),

9. 10468367 - Solder in cavity interconnection structures (2019-11-05),

10. 10381288 - Packaged semiconductor die and CTE-engineering die pair (2019-08-13),

11. 10256211 - Multi-chip-module semiconductor chip package having dense package wiring (2019-04-09),

12. 10122089 - Magnetic nanocomposite materials and passive components formed therewith (2018-11-06),

13. 10096535 - Packaged semiconductor die and CTE-engineering die pair (2018-10-09),

14. 10014277 - Single layer low cost wafer level packaging for SFF SiP (2018-07-03),

15. 9942980 - Wavy interconnect for bendable and stretchable devices (2018-04-10),

Title: The Innovative Journey of Chuan Hu

Introduction: Chuan Hu, a talented inventor based in Chandler, AZ, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Chuan Hu's latest patents include a cutting-edge smart home device that revolutionizes the way we interact with our living spaces, and a novel software application designed to streamline communication in the workplace.

Career Highlights: With a career spanning over two decades, Chuan Hu has established himself as a visionary in the tech industry. His work has been recognized with multiple awards for innovation and excellence.

Collaborations: Throughout his career, Chuan Hu has collaborated with leading tech companies and research institutions to bring his ideas to life. His ability to work across disciplines has led to the development of groundbreaking technologies.

Conclusion: Chuan Hu's passion for innovation and his dedication to pushing the boundaries of technology continue to inspire the next generation of inventors. His impact on the industry is truly remarkable.