The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2020
Filed:
Jul. 22, 2015
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Assignee:
INTEL CORPORATION, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/04 (2006.01); H01L 25/065 (2006.01); H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 21/486 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/563 (2013.01); H01L 21/565 (2013.01); H01L 23/3114 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 25/0652 (2013.01);
Abstract
Embodiments herein relate to a system in package (SiP). The SiP may have a first layer of one or more first functional components with respective first active sides and first inactive sides opposite the first active sides. The SiP may further include a second layer of one or more second functional components with respective second active sides and second inactive sides opposite the second active sides. In embodiments, one or more of the first active sides are facing and electrically coupled with one or more of the second active sides through a through-mold via or a through-silicon via.