The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2018
Filed:
May. 28, 2014
Intel Corporation, Santa Clara, CA (US);
Chuan Hu, Chandler, AZ (US);
Adel A. Elsherbini, Chandler, AZ (US);
Yoshihiro Tomita, Tsukuba, JP;
Shawna Liff, Scottsdale, AZ (US);
INTEL CORPORATION, Santa Clara, CA (US);
Abstract
Embodiments of the present disclosure describe a wavy interconnect for bendable and stretchable devices and associated techniques and configurations. In one embodiment, an interconnect assembly includes a flexible substrate defining a plane and a wavy interconnect disposed on the flexible substrate and configured to route electrical signals of an integrated circuit (IC) device in a first direction that is coplanar with the plane, the wavy interconnect having a wavy profile from a second direction that is perpendicular to the first direction and coplanar with the plane. Other embodiments may be described and/or claimed.