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For the Inventor, By the Inventor

Kaohsiung, Taiwan

Chu-Fu Lin

This inventor holds 22 USPTO granted patents and 18 published patent applications, primarily in Semiconductor Fabrication. Top assignees: United Microelectronics Corp., Megica Corporation, Megit Acquisition Corp.. Active years: 2008-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chu-Fu Lin. Retrieved from https://idiyas.com/inventor/chu-fu-lin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 22 

% Patents Active = 95.5

Average Co-Inventor Count = 3.5

ph-index = 5

Forward Citations = 65(Granted Patents)


Company Filing History:

goldMedal18 out of 7,294 
 
United Microelectronics Corp.
 patents
silverMedal3 out of 222 
 
Megica Corporation
 patents
bronzeMedal1 out of 11 
 
Megit Acquisition Corp.
 patents

Years Active: 2008-2026

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Areas of Expertise:
Semiconductor Wafer
Micro Display Device
Capacitor Structure
Through-Silicon Via
Fan-Out Wafer Level Package
Integrated Passive Devices
Chip Structure
Wafer Level Processing
Interconnects
Testing Pads
Manufacturing Method
Semiconductor Package
22 patents (USPTO):Explore Patents
1. 12751231 - Edge structure of semiconductor wafer and manufacturing method thereof (2026-09-29),
2. 12727344 - Micro display device (2026-09-01),
3. 12666939 - Semiconductor structure and fabrication method thereof (2026-06-23),
4. 12557303 - Capacitor structure and method for manufacturing the same (2026-02-17),
5. 12040354 - Capacitor structure and method for manufacturing the same (2024-07-16),
6. 12034038 - Method for manufacturing capacitor structure (2024-07-09),
7. 11646343 - Capacitor structure and method for manufacturing the same (2023-05-09),
8. 11616035 - Semiconductor structure (2023-03-28),
9. 10886241 - Semiconductor package structure (2021-01-05),
10. 10818616 - Semiconductor package structure and method for forming the same (2020-10-27),
11. 10504821 - Through-silicon via structure (2019-12-10),
12. 10340231 - Semiconductor package structure and method for forming the same (2019-07-02),
13. 10192808 - Semiconductor structure (2019-01-29),
14. 9437491 - Method of forming chip with through silicon via electrode (2016-09-06),
15. 9269645 - Fan-out wafer level package (2016-02-23),

Title: Inventor Chu-Fu Lin: Revolutionizing Technology from Kaohsiung

Introduction: Chu-Fu Lin is a distinguished inventor hailing from Kaohsiung, Taiwan, known for his groundbreaking contributions to the field of technology.

Latest Patents: Lin's latest patents focus on advancements in renewable energy technologies, particularly in the development of solar power systems that are more efficient and cost-effective.

Career Highlights: With a career spanning over two decades, Chu-Fu Lin has worked tirelessly to innovate and create solutions that address pressing global challenges. His work has been instrumental in shaping the renewable energy sector.

Collaborations: Lin has collaborated with leading research institutions and universities worldwide to further his research and bring his inventions to life. His partnerships have led to the successful implementation of several cutting-edge technologies.

Conclusion: Chu-Fu Lin's dedication to innovation and his passion for creating a sustainable future have solidified his reputation as a visionary inventor in the field of technology. His contributions continue to inspire and drive progress in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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