The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2026
Filed:
Jan. 26, 2024
United Microelectronics Corp., Hsin-Chu City, TW;
Chu-Fu Lin, Kaohsiung City, TW;
Chuan-Lan Lin, Chiayi City, TW;
Yu-Ping Wang, Hsinchu City, TW;
Chun-Hung Chen, Tainan City, TW;
UNITED MICROELECTRONICS CORP., Hsin-Chu City, TW;
Abstract
A semiconductor structure includes a bottom wafer having a bottom substrate and a bottom interconnect structure on the bottom substrate, and a top wafer having a top substrate with a front surface and a rear surface and a top interconnect structure disposed on the front surface of the top substrate. The top interconnect structure is directly bonded to the bottom interconnect structure of the bottom wafer. An oxide-nitride-oxide (ONO) dielectric layer covers the rear surface of the top substrate. A plurality of conductive vias is disposed on the rear surface and extending into the ONO dielectric layer and the top substrate.