This inventor holds 4 USPTO granted patents and 17 published patent applications. Top assignee: United Microelectronics Corp.. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Innovations by Chuan-Lan Lin in Semiconductor Technology
Introduction
Chuan-Lan Lin is an inventor based in Chiayi City, Taiwan. He has made significant contributions to the field of semiconductor technology. Although he currently holds no granted patents, his work in developing innovative semiconductor structures and manufacturing methods is noteworthy.
Latest Patent Applications
Chuan-Lan Lin's latest patent applications include a semiconductor structure that features a hybrid bond contact. This structure comprises a first hybrid bond contact located in a dielectric layer, which consists of copper. Additionally, a first top wiring layer made of aluminum is situated within the dielectric layer and below the first hybrid bond contact. A first composite liner layer encapsulates the sidewalls and bottom surface of the first hybrid bond contact, consisting of a titanium layer, a titanium nitride layer, a tantalum nitride layer, and a tantalum layer. Another application details a method for fabricating a semiconductor device, which involves bonding two wafers and conducting various processes to create direct bond interconnects.
Conclusion
Chuan-Lan Lin's innovative approaches in semiconductor technology highlight his potential impact on the industry. His latest patent applications reflect a commitment to advancing semiconductor structures and manufacturing methods.