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For the Inventor, By the Inventor

Hsinchu, Taiwan

Megica Corporation


USPTO Granted Patents = 222


Forward Citations = 2,674

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32 inventors (with patents filed for the assignee):

goldMedal Mou-Shiung Lin (202 out of 354 patents)

silverMedal Jin-Yuan Lee (106 out of 275 patents)

bronzeMedal Chien-Kang Chou (51 out of 61 patents)

4.  Chiu-Ming Chou (48 out of 52 patents)

5.  Ching-Cheng Huang (37 out of 61 patents)

6.  Hsin-Jung Lo (26 out of 30 patents)

7.  Shih-Hsiung Lin (16 out of 26 patents)

8.  Ying-Chih Chen (9 out of 23 patents)

9.  Ke-Hung Chen (8 out of 9 patents)

10.  Ming-Ta Lei (7 out of 54 patents)

11.  Chuen-Jye Lin (7 out of 16 patents)

12.  Ching-San Lin (5 out of 7 patents)

13.  Bryan Peng (4 out of 7 patents)

14.  Chu-Fu Lin (3 out of 18 patents)

15.  Hsi-Shan Kuo (3 out of 5 patents)


Core Competencies:
Semiconductor Devices
Integrated Circuits
Chip Packaging
Post Passivation Process
High Performance ICs
System-On-Chip
Metal Interconnection
Wafer Level Processing
Solder Bump Technology
Fine-Line Metal Traces
Copper Pillar Interconnects
RF Integrated Circuits

222 patents:

1. 8558383 - Post passivation structure for a semiconductor device and packaging process for same (2013-10-15),
2. 8552559 - Very thick metal interconnection scheme in IC chips (2013-10-08),
3. 8546947 - Chip structure and process for forming the same (2013-10-01),
4. 8535976 - Method for fabricating chip package with die and substrate (2013-09-17),
5. 8531038 - Top layers of metal for high performance IC's (2013-09-10),
6. 8519552 - Chip structure (2013-08-27),
7. 8503186 - System-in packages (2013-08-06),
8. 8492900 - Post passivation interconnection schemes on top of IC chip (2013-07-23),
9. 8492870 - Semiconductor package with interconnect layers (2013-07-23),
10. 8487400 - High performance system-on-chip using post passivation process (2013-07-16),
11. 8482127 - Post passivation interconnection schemes on top of IC chip (2013-07-09),
12. 8481418 - Low fabrication cost, high performance, high reliability chip scale package (2013-07-09),
13. 8471389 - Multiple selectable function integrated circuit module (2013-06-25),
14. 8471388 - Integrated circuit and method for fabricating the same (2013-06-25),
15. 8471384 - Top layers of metal for high performance IC's (2013-06-25),
Megica Corporation is a leading technology company specializing in the design and manufacturing of advanced semiconductor solutions. With expertise in system integration, innovative design, and cutting-edge manufacturing processes, Megica provides customized solutions for a wide range of industries, including automotive, consumer electronics, telecommunications, and more. With a commitment to delivering high-quality products and exceptional customer service, Megica Corporation strives to empower businesses with the latest technological advancements.
This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Dec 23 2025

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222 Patents

#24 in Hsinchu

#117 in Taiwan

#3,735 in the World

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Hsinchu, Taiwan

Megica Corporation

Forward Citations = 2,674

32 inventors:

goldMedal Mou-Shiung Lin (202 out of 354 patents)

silverMedal Jin-Yuan Lee (106 out of 275 patents)

bronzeMedal Chien-Kang Chou (51 out of 61 patents)

4.  Chiu-Ming Chou (48 out of 52 patents)

5.  Ching-Cheng Huang (37 out of 61 patents)

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