Ching-Cheng Huang

This inventor holds 61 USPTO granted patents, primarily in Chip Packaging (CPC class H01L). Top assignees: Megica Corporation, Megic Corporation, Qualcomm Incorporated. Active years: 2002-2016.

USPTO Granted Patents = 61

% Patents Active = 52.5

Average Co-Inventor Count = 3.2

ph-index = 20

Forward Citations = 1,432(Granted Patents)

Forward Citations (Not Self Cited) = 1,224(Dec 10, 2025)

Inventors with similar research interests:

Company Filing History:

Qualcomm Incorporated

patents

4. 1 out of 11

Megit Acquisition Corp.

patents

5. 1 out of 786

Wistron Neweb Corporation

patents

Years Active: 2002-2016

Loading Chart...

Areas of Expertise:

Chip Package

Silicon Substrate

Ceramic Substrate

Organic Substrate

Interconnect Layers

Solder Bump

Manufacturing Method

High Reliability

Die Substrate

Metal Layer

Circuitry Component

Fabrication Process

61 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9369175 - Low fabrication cost, high performance, high reliability chip scale package (2016-06-14),

2. 9136246 - Integrated chip package structure using silicon substrate and method of manufacturing the same (2015-09-15),

3. 9030029 - Chip package with die and substrate (2015-05-12),

4. 9018774 - Chip package (2015-04-28),

5. 8912666 - Structure and manufacturing method of chip scale package (2014-12-16),

6. 8901733 - Reliable metal bumps on top of I/O pads after removal of test probe marks (2014-12-02),

7. 8835221 - Integrated chip package structure using ceramic substrate and method of manufacturing the same (2014-09-16),

8. 8748227 - Method of fabricating chip package (2014-06-10),

9. 8546947 - Chip structure and process for forming the same (2013-10-01),

10. 8535976 - Method for fabricating chip package with die and substrate (2013-09-17),

11. 8492870 - Semiconductor package with interconnect layers (2013-07-23),

12. 8481418 - Low fabrication cost, high performance, high reliability chip scale package (2013-07-09),

13. 8471361 - Integrated chip package structure using organic substrate and method of manufacturing the same (2013-06-25),

14. 8426982 - Structure and manufacturing method of chip scale package (2013-04-23),

15. 8368213 - Low fabrication cost, fine pitch and high reliability solder bump (2013-02-05),

Title: The Innovative Journey of Ching-Cheng Huang

Introduction: Ching-Cheng Huang, a pioneering inventor from Hsinchu, Taiwan, has made significant contributions to the field of technology with her groundbreaking innovations.

Latest Patents: Ching-Cheng Huang's latest patents focus on advancements in renewable energy technologies, particularly in the development of solar power systems that are more efficient and cost-effective.

Career Highlights: With a career spanning over two decades, Ching-Cheng Huang has established herself as a leading figure in the tech industry, holding multiple patents in the areas of clean energy, semiconductor technology, and smart devices.

Collaborations: Throughout her career, Ching-Cheng Huang has collaborated with top research institutions and leading tech companies to bring her inventions to life. Her collaborative efforts have led to the successful commercialization of several cutting-edge technologies.

Conclusion: Ching-Cheng Huang's relentless pursuit of innovation and her passion for creating sustainable solutions have solidified her reputation as a trailblazing inventor in the field of technology. Her work continues to inspire future generations of inventors to push the boundaries of what is possible in the world of tech.