Average Co-Inventor Count = 3.2

ph-index = 20

Forward Citations = 1,428(Granted Patents)

Forward Citations (Not Self Cited) = 1,224(Dec 10, 2025)

Inventors with similar research interests:

Company Filing History:

Qualcomm Incorporated

patents

4. 1 out of 722

Wistron Neweb Corporation

patents

5. 1 out of 11

Megit Acquisition Corp.

patents

Years Active: 2002-2016

Loading Chart...

Areas of Expertise:

Chip Scale Package

Integrated Chip Package

Silicon Substrate

Ceramic Substrate

Organic Substrate

Solder Bump

Interconnect Layers

Wireless Transceiver

Circuitry Component

High-Performance Integrated Circuits

Die and Substrate

Manufacturing Method

61 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9369175 - Low fabrication cost, high performance, high reliability chip scale package (2016-06-14),

2. 9136246 - Integrated chip package structure using silicon substrate and method of manufacturing the same (2015-09-15),

3. 9030029 - Chip package with die and substrate (2015-05-12),

4. 9018774 - Chip package (2015-04-28),

5. 8912666 - Structure and manufacturing method of chip scale package (2014-12-16),

6. 8901733 - Reliable metal bumps on top of I/O pads after removal of test probe marks (2014-12-02),

7. 8835221 - Integrated chip package structure using ceramic substrate and method of manufacturing the same (2014-09-16),

8. 8748227 - Method of fabricating chip package (2014-06-10),

9. 8546947 - Chip structure and process for forming the same (2013-10-01),

10. 8535976 - Method for fabricating chip package with die and substrate (2013-09-17),

11. 8492870 - Semiconductor package with interconnect layers (2013-07-23),

12. 8481418 - Low fabrication cost, high performance, high reliability chip scale package (2013-07-09),

13. 8471361 - Integrated chip package structure using organic substrate and method of manufacturing the same (2013-06-25),

14. 8426982 - Structure and manufacturing method of chip scale package (2013-04-23),

15. 8368213 - Low fabrication cost, fine pitch and high reliability solder bump (2013-02-05),

Title: The Innovative Journey of Ching-Cheng Huang

Introduction: Ching-Cheng Huang, a pioneering inventor from Hsinchu, Taiwan, has made significant contributions to the field of technology with her groundbreaking innovations.

Latest Patents: Ching-Cheng Huang's latest patents focus on advancements in renewable energy technologies, particularly in the development of solar power systems that are more efficient and cost-effective.

Career Highlights: With a career spanning over two decades, Ching-Cheng Huang has established herself as a leading figure in the tech industry, holding multiple patents in the areas of clean energy, semiconductor technology, and smart devices.

Collaborations: Throughout her career, Ching-Cheng Huang has collaborated with top research institutions and leading tech companies to bring her inventions to life. Her collaborative efforts have led to the successful commercialization of several cutting-edge technologies.

Conclusion: Ching-Cheng Huang's relentless pursuit of innovation and her passion for creating sustainable solutions have solidified her reputation as a trailblazing inventor in the field of technology. Her work continues to inspire future generations of inventors to push the boundaries of what is possible in the world of tech.

This text is generated by artificial intelligence and may not be accurate.

Please report any incorrect information to support@idiyas.com