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For the Inventor, By the Inventor

Hsinchu, Taiwan

Ching-Cheng Huang

This inventor holds 61 USPTO granted patents, primarily in Chip Packaging (CPC class H01L). Top assignees: Megica Corporation, Megic Corporation, Qualcomm Incorporated. Active years: 2002-2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ching-Cheng Huang. Retrieved from https://idiyas.com/inventor/ching-cheng-huang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 61

% Patents Active = 52.5

Average Co-Inventor Count = 3.2

ph-index = 20

Forward Citations = 1,432(Granted Patents)

Forward Citations (Not Self Cited) = 1,224(Dec 10, 2025)


Inventors with similar research interests:


Company Filing History:

goldMedal37 out of 222 
 
Megica Corporation
 patents
silverMedal15 out of 44 
 
Megic Corporation
 patents
bronzeMedal7 out of 45,309 
 
Qualcomm Incorporated
 patents
4. 1 out of 11 
 
Megit Acquisition Corp.
 patents
5. 1 out of 798 
 
Wistron Neweb Corporation
 patents

Years Active: 2002-2016

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Areas of Expertise:
Chip Package
Silicon Substrate
Ceramic Substrate
Organic Substrate
Interconnect Layers
Solder Bump
Manufacturing Method
High Reliability
Die Substrate
Metal Layer
Circuitry Component
Fabrication Process
61 patents (USPTO):Explore Patents
1. 9369175 - Low fabrication cost, high performance, high reliability chip scale package (2016-06-14),
2. 9136246 - Integrated chip package structure using silicon substrate and method of manufacturing the same (2015-09-15),
3. 9030029 - Chip package with die and substrate (2015-05-12),
4. 9018774 - Chip package (2015-04-28),
5. 8912666 - Structure and manufacturing method of chip scale package (2014-12-16),
6. 8901733 - Reliable metal bumps on top of I/O pads after removal of test probe marks (2014-12-02),
7. 8835221 - Integrated chip package structure using ceramic substrate and method of manufacturing the same (2014-09-16),
8. 8748227 - Method of fabricating chip package (2014-06-10),
9. 8546947 - Chip structure and process for forming the same (2013-10-01),
10. 8535976 - Method for fabricating chip package with die and substrate (2013-09-17),
11. 8492870 - Semiconductor package with interconnect layers (2013-07-23),
12. 8481418 - Low fabrication cost, high performance, high reliability chip scale package (2013-07-09),
13. 8471361 - Integrated chip package structure using organic substrate and method of manufacturing the same (2013-06-25),
14. 8426982 - Structure and manufacturing method of chip scale package (2013-04-23),
15. 8368213 - Low fabrication cost, fine pitch and high reliability solder bump (2013-02-05),

Title: The Innovative Journey of Ching-Cheng Huang

Introduction: Ching-Cheng Huang, a pioneering inventor from Hsinchu, Taiwan, has made significant contributions to the field of technology with her groundbreaking innovations.

Latest Patents: Ching-Cheng Huang's latest patents focus on advancements in renewable energy technologies, particularly in the development of solar power systems that are more efficient and cost-effective.

Career Highlights: With a career spanning over two decades, Ching-Cheng Huang has established herself as a leading figure in the tech industry, holding multiple patents in the areas of clean energy, semiconductor technology, and smart devices.

Collaborations: Throughout her career, Ching-Cheng Huang has collaborated with top research institutions and leading tech companies to bring her inventions to life. Her collaborative efforts have led to the successful commercialization of several cutting-edge technologies.

Conclusion: Ching-Cheng Huang's relentless pursuit of innovation and her passion for creating sustainable solutions have solidified her reputation as a trailblazing inventor in the field of technology. Her work continues to inspire future generations of inventors to push the boundaries of what is possible in the world of tech.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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