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Hsinchu, Taiwan

Megic Corporation

USPTO Granted Patents = 44

Forward Citations = 2,106

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21 inventors (with patents filed for the assignee):

Mou-Shiung Lin (33 out of 354 patents)

Jin-Yuan Lee (21 out of 275 patents)

Ching-Cheng Huang (15 out of 61 patents)

4. Ming-Ta Lei (3 out of 54 patents)

5. Chuen-Jye Lin (3 out of 16 patents)

6. Bryan Peng (3 out of 7 patents)

7. Chien-Kang Chou (2 out of 61 patents)

8. Jin Yuan Lee (2 out of 7 patents)

9. Ming Ta Lei (2 out of 3 patents)

10. Kuo-Hui Wan (2 out of 2 patents)

11. Sehat Sutardja (1 out of 495 patents)

12. Shih-Hsiung Lin (1 out of 26 patents)

13. Hsien-Tsung Liu (1 out of 5 patents)

14. Hsi-Shan Kuo (1 out of 5 patents)

15. Eric Lin (1 out of 3 patents)

Core Competencies:

Integrated Circuits

Chip Scale Packaging

System-on-Chip

Post Passivation Process

Thermal Compliant PCB

Electroplating Structures

High Performance RF ICs

Ceramic Substrate Structures

Multiple Selectable Functions

Wafer Scale Packaging

Low Noise Packaging

Fine Pitch Solder Bumps

44 patents: Sort by Forward Citations

1. 7288845 - Fabrication of wire bond pads over underlying active devices, passive devices and/or dielectric layers in integrated circuits (2007-10-30),

2. 7045901 - Chip-on-chip connection with second chip located in rectangular open window hole in printed circuit board (2006-05-16),

3. 6939747 - Multiple selectable function integrated circuit module (2005-09-06),

4. 6936531 - Process of fabricating a chip structure (2005-08-30),

5. 6917119 - Low fabrication cost, high performance, high reliability chip scale package (2005-07-12),

6. 6897507 - Capacitor for high performance system-on-chip using post passivation device (2005-05-24),

7. 6869870 - High performance system-on-chip discrete components using post passivation process (2005-03-22),

8. 6818545 - Low fabrication cost, fine pitch and high reliability solder bump (2004-11-16),

9. 6815324 - Reliable metal bumps on top of I/O pads after removal of test probe marks (2004-11-09),

10. 6809935 - Thermally compliant PCB substrate for the application of chip scale packages (2004-10-26),

11. 6806570 - Thermal compliant semiconductor chip wiring structure for chip scale packaging (2004-10-19),

12. 6802945 - Method of metal sputtering for integrated circuit metal routing (2004-10-12),

13. 6800941 - Integrated chip package structure using ceramic substrate and method of manufacturing the same (2004-10-05),

14. 6798073 - Chip structure and process for forming the same (2004-09-28),

15. 6791192 - Multiple chips bonded to packaging structure with low noise and multiple selectable functions (2004-09-14),

MEGIC Corporation is a leading technology company specializing in innovative software solutions. With a focus on developing cutting-edge technology, MEGIC offers a wide range of products and services. Our expertise includes software development, data analysis, artificial intelligence, and cloud computing. We strive to provide our clients with tailored solutions that meet their specific business needs. Visit our website for more information about our products and services.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 23 2025

44 Patents

#67 in Hsinchu

#431 in Taiwan

#15,286 in the World

Hsinchu, Taiwan

Megic Corporation

Forward Citations = 2,106

21 inventors:

Mou-Shiung Lin (33 out of 354 patents)

Jin-Yuan Lee (21 out of 275 patents)

Ching-Cheng Huang (15 out of 61 patents)

4. Ming-Ta Lei (3 out of 54 patents)

5. Chuen-Jye Lin (3 out of 16 patents)

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