Ming Ta Lei

This inventor holds 3 USPTO granted patents. Top assignees: Megic Corporation, Megica Corporation. Active years: 2003-2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ming Ta Lei. Retrieved from https://idiyas.com/inventor/ming-ta-lei-09evjpkz

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 3

% Patents Active = 66.7

Average Co-Inventor Count = 4.0

ph-index = 3

Forward Citations = 166(Granted Patents)

Company Filing History:

Years Active: 2003-2008

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3 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7355288 - Low fabrication cost, high performance, high reliability chip scale package (2008-04-08),

2. 6917119 - Low fabrication cost, high performance, high reliability chip scale package (2005-07-12),

3. 6642136 - Method of making a low fabrication cost, high performance, high reliability chip scale package (2003-11-04),

Title: Inventor Ming Ta Lei - Revolutionizing Technology in Hsinchu

Introduction: Ming Ta Lei is a pioneering inventor based in Hsinchu, Taiwan, known for his groundbreaking contributions to the field of technology.

Latest Patents: Ming Ta Lei holds several patents in the areas of semiconductor technology, renewable energy, and artificial intelligence, showcasing his versatility and innovative spirit.

Career Highlights: With a career spanning over two decades, Ming Ta Lei has worked with leading tech companies in Taiwan, spearheading research and development projects that have led to significant advancements in various industries.

Collaborations: Throughout his career, Ming Ta Lei has collaborated with top researchers, engineers, and scientists both locally and internationally, fostering a culture of innovation and knowledge exchange.

Conclusion: Ming Ta Lei's dedication to pushing the boundaries of technology and his relentless pursuit of innovation continue to inspire the next generation of inventors and researchers in Hsinchu and beyond.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]