The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 2004
Filed:
Oct. 10, 2000
Applicant:
Inventor:
Jin-Yuan Lee, Hsin-chu, TW;
Assignee:
Megic Corporation, Hsin-Chu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/10 ;
U.S. Cl.
CPC ...
H05K 7/10 ;
Abstract
A new method is provided for mounting a semiconductor on the surface of a Printed Circuit Board. A layer of Elastomer is deposifed on the surface face of the PCB, this layer of Elastomer makes the PCB into a thermally compliant PCB such that the thermal mismatch between the PCB and the semiconductor die that is mounted on the PCB is sharply reduced. Openings are created in the layer of Elastomer and electrical interfaces are created such that the PCB can be connected to the semiconductor die that is mounted on the PCB.