Eric Lin

This inventor holds 3 USPTO granted patents. Top assignees: Megica Corporation, Megic Corporation. Active years: 2004-2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Eric Lin. Retrieved from https://idiyas.com/inventor/eric-lin-zf6vpl9t

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 3

% Patents Active = 33.3

Average Co-Inventor Count = 2.0

ph-index = 2

Forward Citations = 28(Granted Patents)

Company Filing History:

Years Active: 2004-2012

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3 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8334588 - Circuit component with conductive layer structure (2012-12-18),

2. 7265045 - Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging (2007-09-04),

3. 6806570 - Thermal compliant semiconductor chip wiring structure for chip scale packaging (2004-10-19),

Title: The Innovative Journey of Eric Lin

Introduction: Eric Lin, a visionary inventor hailing from Hsin-Chu, Taiwan, has made significant contributions to the field of technology through his groundbreaking innovations.

Latest Patents: Eric Lin holds several patents in the areas of semiconductor technology and renewable energy solutions, showcasing his commitment to driving progress through inventive solutions.

Career Highlights: With a career spanning over two decades, Eric Lin has worked with leading tech companies in Taiwan, spearheading research and development projects that have led to cutting-edge technological advancements.

Collaborations: Throughout his career, Eric Lin has collaborated with top researchers, engineers, and scientists both locally and internationally, fostering a culture of innovation and knowledge exchange.

Conclusion: Eric Lin's relentless pursuit of innovation and his passion for pushing the boundaries of technology make him a true trailblazer in the world of inventions. His work continues to inspire future generations of inventors and innovators worldwide.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]