The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 18, 2012

Filed:

Apr. 29, 2011
Applicants:

Jin-yuan Lee, Hsin-Chu, TW;

Eric Lin, Hsin-Chu, TW;

Inventors:

Jin-Yuan Lee, Hsin-Chu, TW;

Eric Lin, Hsin-Chu, TW;

Assignee:

Megica Corporation, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A circuit component comprising a substrate, and a conductive layer over the substrate, wherein the conductive layer comprises a first portion between a first opening in the conductive layer and a second opening in the conductive layer, wherein the first and second openings are enclosed by the conductive layer, wherein a void is over the substrate and under the conductive layer, wherein the first portion and the first and second openings are over the void.


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