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For the Inventor, By the Inventor

Hsinchu, Taiwan

Kuo-Hui Wan

This inventor holds 2 USPTO granted patents. Top assignee: Megic Corporation. Active years: 2003-2004.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kuo-Hui Wan. Retrieved from https://idiyas.com/inventor/kuo-hui-wan-6q2x8yan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 2

% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:

goldMedal2 out of 44 
 
Megic Corporation
 patents

Years Active: 2003-2004

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2 patents (USPTO):Explore Patents
1. 6768194 - Electrode for electroplating planar structures (2004-07-27),
2. 6638840 - Electrode for electroplating planar structures (2003-10-28),

Title: Inventor Kuo-Hui Wan

Introduction: Kuo-Hui Wan is a renowned inventor based in Hsin-Chu, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Kuo-Hui Wan holds several patents in the areas of semiconductor technology, renewable energy, and telecommunications, showcasing his diverse range of expertise and innovative thinking.

Career Highlights: With a career spanning over two decades, Wan has worked with leading tech companies in Taiwan, spearheading research and development projects that have led to significant advancements in various industries.

Collaborations: Throughout his career, Kuo-Hui Wan has collaborated with top researchers, engineers, and scientists both locally and internationally, fostering a culture of innovation and knowledge sharing.

Conclusion: Kuo-Hui Wan's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and technologists worldwide.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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