Megic Corporation

Kuo-Hui Wan

An apparatus for electroplating a metal overlay on a substrate having a seed layer deposited on all surfaces. The apparatus includes a cell for containing and circulating an electrolyte and an annular sealing fixture having a &ldquo;J&rdquo; shaped cross section for supporting a peripheral front surface of the substrate. A multiplicity of compliant electrode fingers are inwardly mounted with a downward tilt angle. The compliant fingers make conductive cathodic contact with the seed layer at the peripheral edge of the substrate. A pressure is applied to the back surface of the substrate effecting a wiping action between the compliant fingers and the peripheral edge. A counter electrode is placed towards the bottom of the cell and is circuitous arranged for passing current between the counter electrode and compliant electrode fingers. A pump circulates the electrolyte against the front surface of the substrate.

Electrode for electroplating planar structures

An electrode apparatus for electroplating a metal overlay on a substrate having a front surface, a back surface, and a seed layer deposited on all surfaces. The apparatus includes a cell for containing and circulating an electrolyte; an annular sealing fixture having a &ldquo;J&rdquo; shaped cross section for supporting the peripheral front surface of the substrate. The substrate is supported above the cell by the shorter and inner member of the &ldquo;J&rdquo; shape. A multiplicity of compliant electrode fingers are inwardly mounted with a downward tilt angle, the compliant fingers are equally spaced about the inner periphery of the longer &ldquo;J&rdquo; member. The compliant fingers make conductive cathodic contact with the seed layer at the peripheral edge of the substrate. A pressure is applied to the back surface of the substrate. The pressure effects a wiping action between the compliant fingers and the peripheral edge while holding the substrate against the sealing fixture. A counter electrode is proximally placed towards the bottom of the cell and is circuitous arranged for passing current between the counter electrode and compliant electrode fingers. A pump circulates the electrolyte against the front surface of the. substrate.

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Hsin-Chu, Taiwan

Kuo-Hui Wan