Taipei County, Taiwan

Hsin-Jung Lo

USPTO Granted Patents = 30 


Average Co-Inventor Count = 3.7

ph-index = 10

Forward Citations = 375(Granted Patents)


Location History:

  • Hsinchu, TW (2009)
  • Yonghe, TW (2009 - 2013)
  • Jhonghe, TW (2008 - 2014)
  • Taipei, TW (2011 - 2014)
  • Taipei County, TW (2008 - 2017)

Company Filing History:


Years Active: 2008-2017

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30 patents (USPTO):Explore Patents

Title: Hsin-Jung Lo: Innovations Powering Industries and Enhancing Lives

Introduction:

Throughout his illustrious career, Hsin-Jung Lo, a renowned inventor hailing from Taipei County, TW, has consistently delivered groundbreaking innovations that have propelled industries forward and positively impacted lives across the globe. With a strong emphasis on practicality and efficiency, Lo's remarkable inventions have garnered widespread recognition and admiration from industry experts.

Latest Patents:

Lo's latest patents include the revolutionary "Integrated Circuit Chip using Top Post-Passivation Technology and Bottom Structure Technology." This invention showcases integrated circuit chips and chip packages featuring an over-passivation scheme at the top and a bottom scheme, leveraging cutting-edge post-passivation and bottom structure technologies. These chips enable seamless connections to external circuits or structures, such as ball-grid-array (BGA) substrates, printed circuit boards (PCBs), metal substrates, and more. The accompanying fabrication techniques further exemplify Lo's commitment to driving innovation.

Another notable invention, the "Chip Package and Method for Fabricating the Same," presents a chip package design with a semiconductor substrate, a first metal pad, and a second metal pad. This invention offers flexible bonding options, including tape automated bonding, wire bonding, and anisotropic conductive film, providing versatile solutions for various external circuitry requirements.

Career Highlights:

Hsin-Jung Lo's career is studded with remarkable achievements and milestones. With an impressive portfolio of 30 patents, Lo has showcased his unparalleled expertise across various aspects of innovation and technology. His inventions have revolutionized industries and paved the way for advancements in semiconductor packaging and integrated circuit chips.

Collaborations:

During his career, Lo has collaborated with esteemed organizations, including Megica Corporation and Qualcomm Incorporated. These collaborations provided Lo with opportunities to leverage his expertise and work alongside industry experts, pushing the boundaries of innovation even further. Notable co-workers who have shared the journey with Lo include Mou-Shiung Lin and Chiu-Ming Chou.

Conclusion:

Hsin-Jung Lo's contributions to the field of innovations and patents are truly extraordinary. With his practical and efficient inventions, Lo has not only revolutionized industries but has also significantly improved the lives of people worldwide. His latest patents, including the integration of post-passivation and bottom structure technologies, exemplify his forward-thinking and inventive mindset. Collaborations with prominent companies have further showcased his ability to adapt and excel in collaborative environments. Hsin-Jung Lo's unwavering drive and commitment to innovation continue to inspire and shape the future of technology.

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