The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 2012
Filed:
May. 17, 2006
Mou-shiung Lin, Hsin-Chu, TW;
Hsin-jung Lo, Taipei County, TW;
Chiu-ming Chou, Kaohsiung, TW;
Chien-kang Chou, Tainan Hsien, TW;
Ke-hung Chen, Kao-Hsiung, TW;
Mou-Shiung Lin, Hsin-Chu, TW;
Hsin-Jung Lo, Taipei County, TW;
Chiu-Ming Chou, Kaohsiung, TW;
Chien-Kang Chou, Tainan Hsien, TW;
Ke-Hung Chen, Kao-Hsiung, TW;
Megica Corporation, Hsinchu, TW;
Abstract
A bonding pad structure is fabricated on an integrated circuit (IC) substrate having at least a contact layer on its top surface. A passivation layer covers the top surface of the IC substrate and the contact layer. The passivation layer has an opening exposing a portion of the contact layer. An electrically conductive adhesion/barrier layer directly is bonded to the contact layer. The electrically conductive adhesion/barrier layer extends to a top surface of the passivation layer. A bonding metal layer is stacked on the electrically conductive adhesion/barrier layer.