Company Filing History:

8 out of 222

Megica Corporation

patents

1 out of 41,498

Qualcomm Incorporated

patents

Years Active: 2008-2014

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9 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8884433 - Circuitry component and method for forming the same (2014-11-11),

2. 8558383 - Post passivation structure for a semiconductor device and packaging process for same (2013-10-15),

3. 8399989 - Metal pad or metal bump over pad exposed by passivation layer (2013-03-19),

4. 8304766 - Semiconductor chip with a bonding pad having contact and test areas (2012-11-06),

5. 8294279 - Chip package with dam bar restricting flow of underfill (2012-10-23),

6. 8148822 - Bonding pad on IC substrate and method for making the same (2012-04-03),

7. 7947978 - Semiconductor chip with bond area (2011-05-24),

8. 7582556 - Circuitry component and method for forming the same (2009-09-01),

9. 7468545 - Post passivation structure for a semiconductor device and packaging process for same (2008-12-23),

Title: Inventor Ke-Hung Chen

Introduction: Ke-Hung Chen is a renowned inventor based in Kao-Hsiung, Taiwan, known for his groundbreaking contributions to various fields.

Latest Patents: Ke-Hung Chen holds several patents in the areas of technology and engineering, showcasing his innovative mindset and problem-solving abilities.

Career Highlights: Throughout his career, Ke-Hung Chen has demonstrated a strong passion for innovation, leading to the development of cutting-edge solutions that have made a significant impact in the industry.

Collaborations: Ke-Hung Chen has collaborated with leading research institutions and companies, fostering a culture of creativity and forward thinking in all his projects.

Conclusion: Ke-Hung Chen's dedication to innovation and his remarkable inventions have solidified his reputation as a pioneering inventor in Kao-Hsiung, Taiwan.

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2 patents (EPO):

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1 patent pending (EPO):

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