The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2012
Filed:
Apr. 26, 2011
Mou-shiung Lin, Hsin-Chu, TW;
Huei-mei Yen, Taoyuan, TW;
Hsin-jung Lo, Taipei, TW;
Chiu-ming Chou, Kao-Hsiung, TW;
Ke-hung Chen, Kao-Hsiung, TW;
Mou-Shiung Lin, Hsin-Chu, TW;
Huei-Mei Yen, Taoyuan, TW;
Hsin-Jung Lo, Taipei, TW;
Chiu-Ming Chou, Kao-Hsiung, TW;
Ke-Hung Chen, Kao-Hsiung, TW;
Megica Corporation, Hsinchu, TW;
Abstract
A semiconductor chip comprises a metal pad exposed by an opening in a passivation layer, wherein the metal pad has a testing area and a bond area. During a step of testing, a testing probe contacts with the testing area for electrical testing. After the step of testing, a polymer layer is formed on the testing area with a probe mark created by the testing probe. Alternatively, a semiconductor chip comprises a testing pad and a bond pad respectively exposed by two openings in a passivation layer, wherein the testing pad is connected to the bond pad. During a step of testing, a testing probe contacts with the testing pad for electrical testing. After the step of testing, a polymer layer is formed on the testing pad with a probe mark created by the testing probe.