The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2013
Filed:
Jun. 20, 2006
Chiu-ming Chou, Kaohsiung, TW;
Shih-hsiung Lin, Hsin-Chu, TW;
Mou-shiung Lin, Hsin-Chu, TW;
Hsin-jung Lo, Taipei County, TW;
Chiu-Ming Chou, Kaohsiung, TW;
Shih-Hsiung Lin, Hsin-Chu, TW;
Mou-Shiung Lin, Hsin-Chu, TW;
Hsin-Jung Lo, Taipei County, TW;
Megica Corporation, Hsinchu, TW;
Abstract
This invention provides a wire bonding method, comprising providing an integrated circuit (IC) die having thereon a passivation layer and a plurality of first bonding pads exposed by respective openings in the passivation layer; forming a polymer layer on the passivation layer; forming an adhesive/barrier layer on the polymer layer; forming a metal pad layer on the adhesive/barrier layer; bonding a wire onto the metal pad layer to form a ball bond thereon; and after forming the ball bond on the metal pad layer, running the wire so as to contact the wire with a second bonding pad and forming a wedge bond thereto.