IDiyas

For the Inventor, By the Inventor

Seoul, South Korea

Choon Heung Lee

USPTO Granted Patents = 41 

Average Co-Inventor Count = 4.5

ph-index = 14

Forward Citations = 743(Granted Patents)


Location History:

  • Kyounggi-do, KR (2004 - 2006)
  • Kwangju, KR (2006)
  • Gyeonggi-do, KR (2005 - 2008)
  • Kyunggi-do, KR (2005 - 2008)
  • Gwangju, KR (2007 - 2008)
  • Kwangju-shi, KR (2009)
  • Kwangju-si, KR (2010)
  • Gwangju-si, KR (2010)
  • Seoul, KR (2002 - 2023)

Company Filing History:

goldMedal27 out of 1,009 
 
Amkor Technology, Inc.
 patents
silverMedal6 out of 287 
 
Amkor Technology Singapore Holding Pte. Ltd.
 patents
bronzeMedal3 out of 49,601 
 
Lg Electronics Inc.
 patents
4. 2 out of 4 
 
Amkor Technology Korea, Inc.
 patents
5. 2 out of 1,812 
 
Stats Chippac Pte. Ltd.
 patents
6. 1 out of 832,680 
Other
 patents

Years Active: 2002-2025

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41 patents (USPTO):
1. 12388032 - Semiconductor device with redistribution layers formed utilizing dummy substrates (2025-08-12),
2. 12362343 - Semiconductor device using EMC wafer support system and fabricating method thereof (2025-07-15),
3. 12211808 - Semiconductor device and method of forming discrete antenna modules (2025-01-28),
4. 11855023 - Wafer level fan out semiconductor device and manufacturing method thereof (2023-12-26),
5. 11735539 - Semiconductor device and method of forming discrete antenna modules (2023-08-22),
6. 11600582 - Semiconductor device with redistribution layers formed utilizing dummy substrates (2023-03-07),
7. 11183493 - Semiconductor device using EMC wafer support system and fabricating method thereof (2021-11-23),
8. 10903181 - Wafer level fan out semiconductor device and manufacturing method thereof (2021-01-26),
9. 10707181 - Semiconductor device with redistribution layers formed utilizing dummy substrates (2020-07-07),
10. 10388643 - Semiconductor device using EMC wafer support system and fabricating method thereof (2019-08-20),
11. 10177117 - Method for fabricating semiconductor package having a multi-layer molded conductive substrate and structure (2019-01-08),
12. 10115705 - Semiconductor package and manufacturing method thereof (2018-10-30),
13. 9748154 - Wafer level fan out semiconductor device and manufacturing method thereof (2017-08-29),
14. 9627368 - Semiconductor device using EMC wafer support system and fabricating method thereof (2017-04-18),
15. 9627348 - Laser assisted bonding for semiconductor die interconnections (2017-04-18),

Title: The Innovative Journey of Choon Heung Lee

Introduction: Choon Heung Lee, a pioneering inventor hailing from Seoul, South Korea, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Choon Heung Lee's latest patents showcase his commitment to pushing the boundaries of technological advancement, with a focus on areas such as artificial intelligence, renewable energy, and biotechnology.

Career Highlights: Throughout his illustrious career, Choon Heung Lee has been recognized for his inventive spirit and dedication to creating solutions that have a positive impact on society. His work has garnered international acclaim and has been instrumental in shaping the future of various industries.

Collaborations: Choon Heung Lee has collaborated with leading research institutions, universities, and innovative companies to further his research and bring his inventions to life. His ability to work effectively in multidisciplinary teams has been key to the success of many of his projects.

Conclusion: In conclusion, Choon Heung Lee's innovative mindset, coupled with his passion for creating a better world through technology, has solidified his position as a trailblazing inventor in the global innovation landscape. His relentless pursuit of excellence continues to inspire future generations of inventors and innovators.

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