The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2018
Filed:
Jul. 15, 2016
Amkor Technology, Inc., Tempe, AZ (US);
Jin Young Kim, Seoul, KR;
No Sun Park, Gwangji-si, KR;
Yoon Joo Kim, Seoul, KR;
Choon Heung Lee, Seoul, KR;
Jin Han Kim, Namyangju-si, KR;
Seung Jae Lee, Namyangju-si, KR;
Se Woong Cha, Gwangju-si, KR;
Sung Kyu Kim, Seoul, KR;
Glenn Rinne, Apex, NC (US);
AMKOR TECHNOLOGY, INC., Tempe, AZ (US);
Abstract
A semiconductor package and manufacturing method thereof are disclosed and may include a first semiconductor device comprising a first bond pad on a first surface of the first semiconductor device, a first encapsulant material surrounding side edges of the first semiconductor device, and a redistribution layer (RDL) formed on the first surface of the first semiconductor device and on a first surface of the encapsulant material. The RDL may electrically couple the first bond pad to a second bond pad formed above the first surface of the encapsulant material. A second semiconductor device comprising a third bond pad on a first surface of the second semiconductor device may face the first surface of the first semiconductor device and be electrically coupled to the first bond pad on the first semiconductor device. The first surface of the first semiconductor device may be coplanar with the first surface of the encapsulant material.