Se Woong Cha

This inventor holds 26 USPTO granted patents and 4 published patent applications. Top assignees: Amkor Technology, Inc., Amkor Technology Singapore Holding Pte. Ltd., Src Corporation. Active years: 2011-2025.

USPTO Granted Patents = 26 (Patent Applications = 4)

% Patents Active = 100.0

Average Co-Inventor Count = 6.3

ph-index = 6

Forward Citations = 114(Granted Patents)

Location History:

Seoul, KR (2011 - 2015)
Gyeonggi-do, KR (2015 - 2024)
Gwangju-si, KR (2016 - 2024)

Company Filing History:

17 out of 1,009

Amkor Technology, Inc.

patents

8 out of 329

Amkor Technology Singapore Holding Pte. Ltd.

Years Active: 2011-2025

Loading Chart...

26 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12255197 - Package-on-package type semiconductor package (2025-03-18),

2. 12230661 - Electronic device package and fabricating method thereof (2025-02-18),

3. 12033910 - Wafer-level stack chip package and method of manufacturing the same (2024-07-09),

4. 11961867 - Electronic device package and fabricating method thereof (2024-04-16),

5. 11508712 - Method of manufacturing a package-on-package type semiconductor package (2022-11-22),

6. 11424180 - Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers (2022-08-23),

7. 11362128 - Electronic device package and fabricating method thereof (2022-06-14),

8. 10867984 - Method of manufacturing a package-on-package type semiconductor package (2020-12-15),

9. 10784178 - Wafer-level stack chip package and method of manufacturing the same (2020-09-22),

10. 10692918 - Electronic device package and fabricating method thereof (2020-06-23),

11. 10672699 - Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers (2020-06-02),

12. 10304890 - Electronic device package and fabricating method thereof (2019-05-28),

13. 10290621 - Method of manufacturing a package-on-package type semiconductor package (2019-05-14),

14. 10199322 - Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers (2019-02-05),

15. 10115705 - Semiconductor package and manufacturing method thereof (2018-10-30),

Title: Se Woong Cha - Innovative Inventor from Gwangju-si, KR

Introduction: Se Woong Cha is a renowned inventor hailing from Gwangju-si, South Korea, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Se Woong Cha holds several patents in the areas of robotics, artificial intelligence, and renewable energy technologies, showcasing his diverse range of expertise and innovative thinking.

Career Highlights: With a career spanning over two decades, Se Woong Cha has worked with leading tech companies and research institutions, spearheading projects that have revolutionized the industry.

Collaborations: Throughout his career, Se Woong Cha has collaborated with top engineers, scientists, and researchers globally, fostering a culture of innovation and knowledge exchange.

Conclusion: Se Woong Cha's passion for pushing the boundaries of technology and his relentless pursuit of innovation continue to inspire the next generation of inventors and researchers worldwide.