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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11961867 B1

PDFFull Text
Date of Patent:
Apr. 16, 2024

Filed:

Jun. 10, 2022

Electronic device package and fabricating method thereof

Applicant:

Amkor Technology Singapore Holding Pte. Ltd., Singapore, SG;

Inventors:

Jin Young Kim, Seoul, KR;

No Sun Park, Gwangju-si, KR;

Yoon Joo Kim, Seoul, KR;

Seung Jae Lee, Namyangju-si, KR;

Se Woong Cha, Gwangju-si, KR;

Sung Kyu Kim, Seoul, KR;

Ju Hoon Yoon, Namyangju-si, KR;

Assignee:

Amkor Technology Singapore Holding Pte. Ltd., Singapore, SG;

Attorney:

McAndrews, Held & Malloy, Ltd.

Primary Examiner:

Victor A Mandala

Int. Cl.
CPC ...
H01L 27/146 (2006.01); G06V 40/12 (2022.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/528 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14636 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H01L 23/5286 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 27/14618 (2013.01); H01L 27/14678 (2013.01); G06V 40/12 (2022.01); H01L 21/568 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/211 (2013.01); H01L 2224/214 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/181 (2013.01); H01L 2924/18162 (2013.01);
Abstract

Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 μm or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.

Find Patent Forward Citations

Kim, Jin. (2024). Electronic device package and fabricating method thereof (U.S. Patent No. 11961867). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11961867

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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