The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2019
Filed:
Nov. 14, 2017
Amkor Technology, Inc., Tempe, AZ (US);
Jong Sik Paek, Incheon, KR;
Jin Young Kim, Seoul, KR;
YoonJoo Kim, Seoul, KR;
Jin Han Kim, Gyeonggi-do, KR;
SeungJae Lee, Gyeonggi-do, KR;
Se Woong Cha, Gyeonggi-do, KR;
SungKyu Kim, Seoul, KR;
Jae Hun Bae, Seoul, KR;
Dong Jin Kim, Gwangju, KR;
Doo Hyun Park, Gyeonggi-do, KR;
AMKOR TECHNOLOGY, INC., Tempe, AZ (US);
Abstract
A semiconductor device with a redistribution structure on partial encapsulation is disclosed and may include an electronic device having a top surface, a bottom surface, and side surfaces between the top and bottom surfaces of the electronic device. An encapsulant may encapsulate the side surfaces of the electronic device, a contact pad may be on the top surface of the electronic device, and a redistribution structure may be coupled to the contact pad. The redistribution structure may include a linear portion and a bump pad, and a conductive bump on the bump pad may include a main bump and a protruding part extending toward the linear portion, where the protruding part may be smaller than the main bump.