Forward Citations = 69

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12 inventors (with patents filed for the assignee):

Do Hyun Na (2 out of 15 patents)

Choon Heung Lee (2 out of 42 patents)

Ki Cheol Bae (2 out of 2 patents)

4. Jong Sik Paek (1 out of 72 patents)

5. Duk-Soon Choi (1 out of 1 patent)

6. In-Seol Hwang (1 out of 1 patent)

7. Woo-Yoel Jeong (1 out of 2 patents)

8. Seong-Han Park (1 out of 1 patent)

9. In-Seob Kwon (1 out of 1 patent)

10. Dong-Shin Kim (1 out of 1 patent)

11. Chang Deok Lee (1 out of 6 patents)

12. In Bae Park (1 out of 17 patents)

4 patents: Sort by Forward Citations

1. 9664706 - Semiconductor chip testing apparatus for picking up and testing a semiconductor chip (2017-05-30),

2. 8802494 - Method of fabricating a semiconductor device having an interposer (2014-08-12),

3. 8446017 - Stackable wafer level package and fabricating method thereof (2013-05-21),

4. 8183678 - Semiconductor device having an interposer (2012-05-22),

Company Overview

Amkor Technology Korea, Inc. is a leading provider of outsourced semiconductor packaging and test services. The company offers a range of advanced packaging and test technologies, including wafer-level packaging, flip chip, and system-in-package. With a focus on innovation and quality, Amkor helps customers bring their products to market quickly and efficiently.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

4 Patents

#35 in Gwangju

#2,200 in South Korea

Gwangju, South Korea

Amkor Technology Korea, Inc.

Forward Citations = 69

12 inventors:

Do Hyun Na (2 out of 15 patents)

Choon Heung Lee (2 out of 42 patents)

Ki Cheol Bae (2 out of 2 patents)

4. Jong Sik Paek (1 out of 72 patents)

5. Duk-Soon Choi (1 out of 1 patent)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Amkor Technology Korea, Inc.. Retrieved from https://idiyas.com/company/amkor-technology-korea

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]