Forward Citations = 68

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12 inventors (with patents filed for the assignee):

Do Hyun Na (2 out of 15 patents)

Choon Heung Lee (2 out of 41 patents)

Ki Cheol Bae (2 out of 2 patents)

4. Jong Sik Paek (1 out of 70 patents)

5. Duk-Soon Choi (1 out of 1 patent)

6. In-Seol Hwang (1 out of 1 patent)

7. Woo-Yoel Jeong (1 out of 2 patents)

8. Seong-Han Park (1 out of 1 patent)

9. In-Seob Kwon (1 out of 1 patent)

10. Dong-Shin Kim (1 out of 1 patent)

11. Chang Deok Lee (1 out of 6 patents)

12. In Bae Park (1 out of 16 patents)

4 patents: Sort by Forward Citations

1. 9664706 - Semiconductor chip testing apparatus for picking up and testing a semiconductor chip (2017-05-30),

2. 8802494 - Method of fabricating a semiconductor device having an interposer (2014-08-12),

3. 8446017 - Stackable wafer level package and fabricating method thereof (2013-05-21),

4. 8183678 - Semiconductor device having an interposer (2012-05-22),

Amkor Technology Korea, Inc. is a leading provider of outsourced semiconductor packaging and test services. The company offers a range of advanced packaging and test technologies, including wafer-level packaging, flip chip, and system-in-package. With a focus on innovation and quality, Amkor helps customers bring their products to market quickly and efficiently.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

4 Patents

#24 in Gwangju

#2,089 in South Korea

Gwangju, South Korea

Amkor Technology Korea, Inc.