The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2012
Filed:
Aug. 04, 2009
Applicants:
Choon Heung Lee, Seoul, KR;
Ki Cheol Bae, Seoul, KR;
DO Hyun NA, Seoul, KR;
Inventors:
Assignee:
AMKOR Technology Korea, Inc., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/52 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device and a method of fabricating the same. An interposer used for the semiconductor device includes integrated circuits therein to realize the functions of a decoupling capacitor, an ESD preventing circuit, an impedance matching circuit, and termination. The semiconductor device may include a semiconductor die with a through silicon via (TSV) structure having two or more through electrodes that pass through the semiconductor die, in which each of the through electrodes are connected to a respective bond pad of the semiconductor die.