The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2023

Filed:

Nov. 09, 2020
Applicant:

Stats Chippac Pte. Ltd., Singapore, SG;

Inventors:

HunTeak Lee, Gyeongi-do, KR;

Choon Heung Lee, Seoul, KR;

JunHo Ye, Seoul, KR;

Assignee:

STATS ChipPAC Pte. Ltd., Singapore, SG;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01Q 1/22 (2006.01); H01L 23/552 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 21/4853 (2013.01); H01L 21/565 (2013.01); H01L 23/3121 (2013.01); H01L 23/5386 (2013.01); H01L 23/552 (2013.01); H01Q 1/2283 (2013.01); H01L 2223/6677 (2013.01);
Abstract

A semiconductor device has an electronic component assembly, and a plurality of discrete antenna modules disposed over the electronic component assembly. Each discrete antenna module is capable of providing RF communication for the electronic component assembly. RF communication can be enabled for a first one of the discrete antenna modules, while RF communication is disabled for a second one of the discrete antenna modules. Alternatively, RF communication is enabled for the second one of the discrete antenna modules, while RF communication is disabled for the first one of the discrete antenna modules. A bump is formed over the discrete antenna modules. An encapsulant is deposited around the discrete antenna modules. A shielding layer is formed over the electronic components assembly. A stud or core ball can be formed internal to a bump connecting the discrete antenna modules to the electronic component assembly.


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