The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 2019
Filed:
Apr. 19, 2016
Amkor Technology Inc., Tempe, AZ (US);
Won Bae Bang, Gyeonggi-do, KR;
Ju Hoon Yoon, Gyeonggi-do, KR;
Ji Young Chung, Gyeonggi-do, KR;
Byong Jin Kim, Gyeonggi-do, KR;
Gi Jeong Kim, Gyeonggi-do, KR;
Choon Heung Lee, Seoul, KR;
Amkor Technology Inc., Tempe, AZ (US);
Abstract
In one embodiment, a method for fabricating a semiconductor package includes providing a multi-layer molded conductive structure. The multi-layer molded conductive structure includes a first conductive structure disposed on a surface of a carrier and a first encapsulant covering at least portions of the first conductive structure while other portions are exposed in the first encapsulant. A second conductive structure is disposed on the first encapsulant and electrically connected to the first conductive structure. A second encapsulant covers a first portion of the second conductive structure while a second portion of the second conductive structure is exposed to the outside, and a third portion of the second conductive structure is exposed in a receiving space disposed in the second encapsulant. The method includes electrically connecting a semiconductor die to the second conductive structure and in some embodiments removing the carrier.