Seongnam-si, South Korea

Won Bae Bang

USPTO Granted Patents = 29 

Average Co-Inventor Count = 3.8

ph-index = 3

Forward Citations = 39(Granted Patents)


Location History:

  • Seongdong-gu, KR (2014)
  • Seoul, KR (2016 - 2018)
  • Gyeonggi-do, KR (2017 - 2024)
  • Seongnam-si, KR (2017 - 2024)
  • Incheon, KR (2022 - 2024)

Company Filing History:


Years Active: 2014-2024

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29 patents (USPTO):Explore Patents

Title: Innovations by Won Bae Bang: A Pioneer in Semiconductor Packaging

Introduction: Won Bae Bang is a notable inventor based in Seongnam-si, South Korea, who has made significant contributions to the field of semiconductor packaging. With an impressive portfolio of 29 patents, Bang has established himself as a key figure in advancing technology and innovation in this critical area.

Latest Patents: Among his latest patents are groundbreaking inventions in semiconductor packaging. One notable invention is a semiconductor package featuring a routable encapsulated conductive substrate. This design includes a routable molded lead frame structure enhanced with a surface finish layer. The structure incorporates a first laminated layer containing vias that connect to the surface finish, as well as multiple resin layers ensuring reliable electrical connection and encapsulation of the semiconductor die.

Additionally, he holds a patent for a method of forming a molded substrate electronic package, which features a substrate with embedded lands and conductive patterns. This innovative package design allows for better integration of electronic devices, making substantial advancements in electronic packaging technology.

Career Highlights: Throughout his career, Won Bae Bang has held key positions in prominent organizations such as Amkor Technology, Inc. and Amkor Technology Singapore Holding Pte. Ltd. His work at these companies has focused on enhancing the efficiency and performance of semiconductor devices through innovative packaging solutions.

Collaborations: Bang has collaborated with esteemed colleagues, including Byong Jin Kim and Gi Jeong Kim. These partnerships have fostered an environment of innovation, combining their expertise to drive advancements in semiconductor technology.

Conclusion: Won Bae Bang's contributions to semiconductor packaging and his innovative inventions mark a significant impact on the industry. With numerous patents to his name, he continues to inspire future developments in technology, demonstrating the importance of innovation and collaboration within research and development. His work remains crucial as the demand for more sophisticated electronic devices grows.

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