The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2024
Filed:
Sep. 02, 2021
Applicant:
Amkor Technology Singapore Holding Pte Ltd., Singapore, SG;
Inventors:
Won Bae Bang, Seongnam-si, KR;
Kwang Seok Oh, Seongnam-si, KR;
Assignee:
AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/14 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49805 (2013.01); H01L 21/561 (2013.01); H01L 23/49827 (2013.01); H01L 23/49861 (2013.01); H01L 23/145 (2013.01); H01L 23/147 (2013.01); H01L 23/3128 (2013.01); H01L 23/49811 (2013.01); H01L 23/562 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/97 (2013.01); H01L 2924/15311 (2013.01);
Abstract
A thin semiconductor device with enhanced edge protection, and a method of manufacturing thereof. For example and without limitation, various aspects of this disclosure provide a thin semiconductor device comprising a substrate with an edge-protection region, and a method of manufacturing thereof.