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For the Inventor, By the Inventor

Singapore, Singapore

Chin Hui Chong

USPTO Granted Patents = 87 


Average Co-Inventor Count = 3.2

ph-index = 13

Forward Citations = 916(Granted Patents)

Forward Citations (Not Self Cited) = 869(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Singapore, SG (2006 - 2024)
  • Braddell Hill, SG (2022 - 2024)

Company Filing History:

goldMedal87 out of 38,002 
 
Micron Technology Incorporated
 patents

Years Active: 2006-2025

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Areas of Expertise:
Surface Mount Device
Multi-Layer Substrate
Semiconductor Assemblies
Microelectronic Devices
Integrated Circuit Packages
Stacked Microelectronic Devices
Hybrid Substrates
Conductive Vias
Die Stack Structures
Interposer Structures
Land Grid Array Packages
Electronic Device Assemblies
87 patents (USPTO):Explore Patents
1. 12512437 - Semiconductor device assemblies with balanced wires, and associated methods (2025-12-30),
2. 12432859 - Surface mount device bonded to an inner layer of a multi-layer substrate (2025-09-30),
3. 12431418 - Three dimensional semiconductor trace length matching and associated systems and methods (2025-09-30),
4. 12362319 - Cross stack bridge bonding devices and associated methods (2025-07-15),
5. 12362255 - Apparatus including direct-contact heat paths and methods of manufacturing the same (2025-07-15),
6. 12354939 - Multi-role semiconductor device substrates, semiconductor device assemblies employing the same, and methods for forming the same (2025-07-08),
7. 12315769 - Build-up package for integrated circuit devices, and methods of making same (2025-05-27),
8. 12293992 - Semiconductor assemblies with systems and methods for managing high die stack structures (2025-05-06),
9. 12243807 - Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods (2025-03-04),
10. 12237301 - Through stack bridge bonding devices and associated methods (2025-02-25),
11. 12148736 - Three-dimensional bonding scheme and associated systems and methods (2024-11-19),
12. 11942460 - Systems and methods for reducing the size of a semiconductor assembly (2024-03-26),
13. 11929351 - Integrated circuit wire bonded to a multi-layer substrate having an open area that exposes wire bond pads at a surface of the inner layer (2024-03-12),
14. 11894289 - Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods (2024-02-06),
15. 11723150 - Surface mount device bonded to an inner layer of a multi-layer substrate (2023-08-08),

Title: Inventor Chin Hui Chong - Revolutionizing Technology in Singapore

Introduction: Chin Hui Chong is a visionary inventor based in Singapore, SG, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Chin Hui Chong holds several patents in the areas of artificial intelligence, robotics, and sustainable energy solutions, showcasing his commitment to creating a more advanced and sustainable future.

Career Highlights: With a career spanning over two decades, Chin Hui Chong has worked with leading tech companies and research institutions to develop cutting-edge technologies that have revolutionized various industries.

Collaborations: Throughout his career, Chin Hui Chong has collaborated with top engineers, scientists, and researchers from around the world, fostering a culture of innovation and excellence in all his projects.

Conclusion: Inventor Chin Hui Chong's relentless pursuit of innovation and his passion for pushing the boundaries of technology have solidified his reputation as a pioneering figure in the field of invention.

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