The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2026
Filed:
Aug. 02, 2022
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Seng Kim Ye, Singapore, SG;
Kelvin Tan Aik Boo, Singapore, SG;
Hong Wan Ng, Singapore, SG;
Chin Hui Chong, Singapore, SG;
Assignee:
Micron Technology, Inc., Bosie, ID;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2023.01); H01L 21/304 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 21/3043 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 2224/16221 (2013.01); H01L 2224/48147 (2013.01); H01L 2224/48149 (2013.01); H01L 2224/48221 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06562 (2013.01); H01L 2924/1011 (2013.01); H01L 2924/10158 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/1438 (2013.01); H01L 2924/1815 (2013.01); H01L 2924/182 (2013.01);
Abstract
A semiconductor device assembly is provided. The assembly includes an outer semiconductor device which has an active surface and a back surface. The back surface includes a cut that extends to a depth between the active surface and the back surface, and uncut regions on opposing sides of the cut. The assembly further includes an inner semiconductor device disposed within the cut of the outer semiconductor device.