Hong Wan Ng

This inventor holds 72 USPTO granted patents and 61 published patent applications and 2 EPO patents, primarily in Semiconductor Packaging. Top assignee: Micron Technology Incorporated. Active years: 2011-2026.

USPTO Granted Patents = 72 (Patent Applications = 61)

% Patents Active = 88.9

EPO Patents = 2 (Patent Applications = 3)

Average Co-Inventor Count = 3.1

ph-index = 6

Forward Citations = 118(Granted Patents)

Forward Citations (Not Self Cited) = 64(Dec 10, 2025)

Company Filing History:

72 out of 39,149

Micron Technology Incorporated

patents

Years Active: 2011-2026

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Areas of Expertise:

Multi-Chip Package

Wire Bonding

Semiconductor Assemblies

Flexible Interposer

Die Stack Structures

Integrated Circuit Devices

Conductive Adhesive

Hybrid Substrates

Stacked Capacitors

Three-Dimensional Bonding

Decoupling Capacitors

Microelectronic Packaging

72 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12727515 - Stacked semiconductor die assemblies with support members and associated systems and methods (2026-09-01),

2. 12685220 - Modular systems in packages, and associated devices, systems, and methods (2026-07-14),

3. 12677678 - Semiconductor assemblies with systems and methods for using an interchangeable interposer to connect die to common substrate (2026-07-07),

4. 12660716 - Stacked semiconductor die assemblies with die support members and associated systems and methods (2026-06-16),

5. 12628267 - Microelectronic device package assemblies including stiffener devices, and related microelectronic devices and electronic systems (2026-05-12),

6. 12593706 - Multi-chip package with enhanced conductive layer adhesion (2026-03-31),

7. 12588527 - Dielectric interposer with electrical-connection cut-in (2026-03-24),

8. 12581976 - Wire bonding directly on exposed conductive vias and interconnects and related systems and methods (2026-03-17),

9. 12564096 - Nested semiconductor assemblies and methods for making the same (2026-02-24),

10. 12532781 - Stacked capacitors for semiconductor devices and associated systems and methods (2026-01-20),

11. 12525521 - Package substrate for a semiconductor device (2026-01-13),

12. 12512437 - Semiconductor device assemblies with balanced wires, and associated methods (2025-12-30),

13. 12476216 - Wire bonding for stacked memory dies (2025-11-18),

14. 12463140 - Flexible interposer for semiconductor dies (2025-11-04),

15. 12444709 - Overlapping die stacks for NAND package architecture (2025-10-14),

Title: Inventor Hong Wan Ng - Revolutionizing Technology in Singapore

Introduction: Hong Wan Ng is a visionary inventor hailing from Singapore, SG, known for his groundbreaking contributions to the field of technology.

Latest Patents: Hong Wan Ng holds several patents in the areas of artificial intelligence, renewable energy, and sustainable technologies, showcasing his commitment to innovation and sustainability.

Career Highlights: With a career spanning over two decades, Hong Wan Ng has worked with leading tech companies and research institutions, spearheading projects that have pushed the boundaries of technological advancements.

Collaborations: Throughout his career, Hong Wan Ng has collaborated with top researchers, engineers, and scientists globally, fostering a culture of innovation and knowledge exchange.

Conclusion: Hong Wan Ng's relentless pursuit of innovation and his passion for creating a sustainable future through technology make him a prominent figure in the world of inventors.