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For the Inventor, By the Inventor

Singapore, Singapore

Hong Wan Ng

This inventor holds 73 USPTO granted patents and 64 published patent applications and 2 EPO patents, primarily in Semiconductor Packaging. Top assignee: Micron Technology Incorporated. Active years: 2011-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hong Wan Ng. Retrieved from https://idiyas.com/inventor/hong-wan-ng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 73 

% Patents Active = 87.7

 

Average Co-Inventor Count = 3.0

ph-index = 6

Forward Citations = 123(Granted Patents)

Forward Citations (Not Self Cited) = 64(Dec 10, 2025)


Company Filing History:

goldMedal73 out of 39,294 
 
Micron Technology Incorporated
 patents

Years Active: 2011-2026

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Areas of Expertise:
Multi-Chip Package
Wire Bonding
Semiconductor Assemblies
Flexible Interposer
Die Stack Structures
Integrated Circuit Devices
Conductive Adhesive
Hybrid Substrates
Stacked Capacitors
Three-Dimensional Bonding
Decoupling Capacitors
Microelectronic Packaging
73 patents (USPTO):Explore Patents
1. 12757414 - Bondable pillars for wire bonds in a semiconductor package (2026-10-06),
2. 12727515 - Stacked semiconductor die assemblies with support members and associated systems and methods (2026-09-01),
3. 12685220 - Modular systems in packages, and associated devices, systems, and methods (2026-07-14),
4. 12677678 - Semiconductor assemblies with systems and methods for using an interchangeable interposer to connect die to common substrate (2026-07-07),
5. 12660716 - Stacked semiconductor die assemblies with die support members and associated systems and methods (2026-06-16),
6. 12628267 - Microelectronic device package assemblies including stiffener devices, and related microelectronic devices and electronic systems (2026-05-12),
7. 12593706 - Multi-chip package with enhanced conductive layer adhesion (2026-03-31),
8. 12588527 - Dielectric interposer with electrical-connection cut-in (2026-03-24),
9. 12581976 - Wire bonding directly on exposed conductive vias and interconnects and related systems and methods (2026-03-17),
10. 12564096 - Nested semiconductor assemblies and methods for making the same (2026-02-24),
11. 12532781 - Stacked capacitors for semiconductor devices and associated systems and methods (2026-01-20),
12. 12525521 - Package substrate for a semiconductor device (2026-01-13),
13. 12512437 - Semiconductor device assemblies with balanced wires, and associated methods (2025-12-30),
14. 12476216 - Wire bonding for stacked memory dies (2025-11-18),
15. 12463140 - Flexible interposer for semiconductor dies (2025-11-04),

Title: Inventor Hong Wan Ng - Revolutionizing Technology in Singapore

Introduction: Hong Wan Ng is a visionary inventor hailing from Singapore, SG, known for his groundbreaking contributions to the field of technology.

Latest Patents: Hong Wan Ng holds several patents in the areas of artificial intelligence, renewable energy, and sustainable technologies, showcasing his commitment to innovation and sustainability.

Career Highlights: With a career spanning over two decades, Hong Wan Ng has worked with leading tech companies and research institutions, spearheading projects that have pushed the boundaries of technological advancements.

Collaborations: Throughout his career, Hong Wan Ng has collaborated with top researchers, engineers, and scientists globally, fostering a culture of innovation and knowledge exchange.

Conclusion: Hong Wan Ng's relentless pursuit of innovation and his passion for creating a sustainable future through technology make him a prominent figure in the world of inventors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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