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For the Inventor, By the Inventor

Singapore, Singapore

Hong Wan Ng

USPTO Granted Patents = 60 

 

Average Co-Inventor Count = 3.0

ph-index = 6

Forward Citations = 105(Granted Patents)

Forward Citations (Not Self Cited) = 64(Dec 10, 2025)


Company Filing History:

goldMedal60 out of 37,972 
 
Micron Technology Incorporated
 patents

Years Active: 2011-2025

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Areas of Expertise:
Wire Bonding
Semiconductor Packaging
Die Stacking
Microelectronic Devices
Flexible Interposer
NAND Package Architecture
Conductive Adhesive Assembly
Three-Dimensional Bonding
Integrated Circuit Substrates
Memory Device Controllers
High Die Stack Management
Hybrid Substrates
60 patents (USPTO):Explore Patents
1. 12476216 - Wire bonding for stacked memory dies (2025-11-18),
2. 12463140 - Flexible interposer for semiconductor dies (2025-11-04),
3. 12444709 - Overlapping die stacks for NAND package architecture (2025-10-14),
4. 12438113 - Conductive adhesive assembly for semiconductor die attachment (2025-10-07),
5. 12432859 - Surface mount device bonded to an inner layer of a multi-layer substrate (2025-09-30),
6. 12431418 - Three dimensional semiconductor trace length matching and associated systems and methods (2025-09-30),
7. 12412811 - Split via structure for semiconductor device packaging (2025-09-09),
8. 12374612 - Microelectronic device packages and related methods and systems (2025-07-29),
9. 12368113 - Methods and apparatus for using spacer-on-spacer design for solder joint reliability improvement in semiconductor devices (2025-07-22),
10. 12362319 - Cross stack bridge bonding devices and associated methods (2025-07-15),
11. 12362255 - Apparatus including direct-contact heat paths and methods of manufacturing the same (2025-07-15),
12. 12362247 - Semiconductor devices with flexible spacer including a support structure and methods of making the same (2025-07-15),
13. 12354939 - Multi-role semiconductor device substrates, semiconductor device assemblies employing the same, and methods for forming the same (2025-07-08),
14. 12315769 - Build-up package for integrated circuit devices, and methods of making same (2025-05-27),
15. 12293992 - Semiconductor assemblies with systems and methods for managing high die stack structures (2025-05-06),

Title: Inventor Hong Wan Ng - Revolutionizing Technology in Singapore

Introduction: Hong Wan Ng is a visionary inventor hailing from Singapore, SG, known for his groundbreaking contributions to the field of technology.

Latest Patents: Hong Wan Ng holds several patents in the areas of artificial intelligence, renewable energy, and sustainable technologies, showcasing his commitment to innovation and sustainability.

Career Highlights: With a career spanning over two decades, Hong Wan Ng has worked with leading tech companies and research institutions, spearheading projects that have pushed the boundaries of technological advancements.

Collaborations: Throughout his career, Hong Wan Ng has collaborated with top researchers, engineers, and scientists globally, fostering a culture of innovation and knowledge exchange.

Conclusion: Hong Wan Ng's relentless pursuit of innovation and his passion for creating a sustainable future through technology make him a prominent figure in the world of inventors.

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