The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2026
Filed:
Jan. 26, 2024
Micron Technology, Inc., Boise, ID (US);
Prasad Nagavenkata Nune, Hyderabad, IN;
Christopher Glancey, Boise, ID (US);
Yeow Chon Ong, Singapore, SG;
Hong Wan Ng, Singapore, SG;
Micron Technology, Inc., Boise, ID (US);
Abstract
A microelectronic device package assembly includes a package board and a stiffener device attached to the package board. The package board has a first side and a second side. The stiffener device includes an upper stiffener, a lower stiffener, and one or more damper devices. The upper stiffener is above the first side of the package board and has a die side and a package side. The lower stiffener is interposed between the upper stiffener and the package board and has a damper side and a board side. The lower stiffener includes through-package anchors extending from the board side and through the package board. The one or more damper devices are interposed between and are in contact with each of the upper stiffener and the lower stiffener. Microelectronic devices and electronic systems are also described.