Boise, ID, United States of America

Christopher Glancey

This inventor holds 19 USPTO granted patents and 15 published patent applications, primarily in Semiconductor Packaging. Top assignee: Micron Technology Incorporated. Active years: 2021-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Christopher Glancey. Retrieved from https://idiyas.com/inventor/christopher-glancey

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 19 

% Patents Active = 84.2

Average Co-Inventor Count = 3.2

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2021-2026

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Areas of Expertise:
Printed Circuit Board
Microelectronic Device
Solder Mask
Warpage Control
Drop Resilience
Reinforced Substrates
Conductive Elements
Self-Healing Solder
Stacked Semiconductor
Heat Sinks
Strength Measurement
Shock Resilience
19 patents (USPTO):Explore Patents

Title: Christopher Glancey: Innovator in Semiconductor Device Resilience

Introduction

Christopher Glancey is a notable inventor residing in Boise, ID, with a remarkable portfolio of 13 patents. His work primarily focuses on enhancing the resilience of semiconductor devices, reflecting a commitment to innovation and advancement in technology.

Latest Patents

Glancey's latest patents include groundbreaking methods and apparatus aimed at improving drop and shock resilience in semiconductor devices. One patent describes a semiconductor package assembly that features a first mounting surface of a package substrate aligned with a second mounting surface of a printed circuit board. It incorporates structural elements that absorb mechanical shock, thus enhancing the durability of the device during compressive forces.

Another significant patent presents semiconductor devices equipped with reinforcement structures designed to mitigate thermomechanical stresses. This innovation involves a semiconductor package comprising a semiconductor die and a substrate. The substrate integrates a reinforcement structure that boasts higher stiffness than its base, effectively protecting the device from thermal and mechanical challenges.

Career Highlights

Christopher Glancey is affiliated with Micron Technology Incorporated, a major player in the semiconductor industry, where his expertise significantly contributes to the company's advancements in device technology. His patents demonstrate a forward-thinking approach to solving industry-wide challenges, establishing him as a key inventor in the field.

Collaborations

Throughout his career, Glancey has collaborated with skilled professionals such as Shams U Arifeen and Koustav Sinha. These partnerships highlight a shared commitment to innovative solutions and further enhance the quality and impact of their contributions to semiconductor technology.

Conclusion

In conclusion, Christopher Glancey stands out as a prominent inventor with a focus on improving semiconductor device resilience through innovative patents. His work at Micron Technology Incorporated, combined with his collaborative spirit, underscores his vital role in advancing the field of semiconductor technologies.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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