The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2025
Filed:
Feb. 02, 2022
Micron Technology, Inc., Boise, ID (US);
Koustav Sinha, Boise, ID (US);
Quang Nguyen, Boise, ID (US);
Christopher Glancey, Boise, ID (US);
Shams U. Arifeen, Boise, ID (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
A semiconductor package assembly includes a first mounting surface of a package substrate that faces a second mounting surface of a printed circuit board. A first structural element bond pad is mounted to the first mounting surface. A second structural element bond pad is mounted to the second mounting surface, and the first and second structural element bond pads are aligned with each other. A structural element is interconnected with a first solder joint to the first structural element bond pad and interconnected with a second solder joint to the second structural element bond pad. The structural element extends between the first and second structural element bond pads to absorb mechanical shock when a compressive force pushes one of the first and second mounting surfaces toward the other.