The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2023
Filed:
Dec. 30, 2021
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Quang Nguyen, Boise, ID (US);
Christopher Glancey, Boise, ID (US);
Shams U Arifeen, Bellevue, WA (US);
Koustav Sinha, Boise, ID (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/18 (2023.01); H05K 1/18 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H05K 3/34 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 24/16 (2013.01); H01L 25/50 (2013.01); H05K 1/0271 (2013.01); H05K 1/183 (2013.01); H05K 3/3436 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/15153 (2013.01); H05K 3/0017 (2013.01); H05K 2201/10159 (2013.01);
Abstract
Various embodiments described herein provide for printed circuit boards with one or more spaces for embedding components, which can be used to implement a memory sub-system.