The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2026

Filed:

Oct. 10, 2022
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Kaleb A. Wilson, Caldwell, ID (US);

Bradley R. Bitz, Meridian, ID (US);

Mark A. Tverdy, Boise, ID (US);

Quang Nguyen, Boise, ID (US);

Christopher Glancey, Boise, ID (US);

Jagadeesh B. Ginjupalli, Fremont, CA (US);

Pridhvi Dandu, Colorado, CA (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/02 (2006.01); G06F 1/184 (2026.01);
U.S. Cl.
CPC ...
H05K 5/0217 (2013.01); G06F 1/184 (2013.01);
Abstract

Apparatuses, systems, and methods for a damper for a printed circuit board assembly (PCBA). One example apparatus can include a PCBA of a solid state drive (SSD) and a damper configured to contact the PCBA, contact an enclosure of the SSD, and damp shock impulses applied to the SSD.


Find Patent Forward Citations

Wilson, Kaleb. (2026). Damper for a printed circuit board assembly (U.S. Patent No. 12764875). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12764875

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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