This inventor holds 1 USPTO granted patent. Top assignee: Micron Technology Incorporated. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Pridhvi Dandu and His Printed Circuit Board Damper Patent.
Introduction
Pridhvi Dandu is an inventor associated with Micron Technology Incorporated. The provided information places him in Colorado, CA (US), and identifies one patent in his record.
Latest Patents
Dandu’s listed patent is “Damper for a Printed Circuit Board Assembly.” It describes apparatuses, systems, and methods for damping shock impulses applied to a solid-state drive (SSD). One example includes a damper configured to contact both the SSD’s printed circuit board assembly (PCBA) and the SSD enclosure.
Career Highlights
The available information highlights Dandu’s work on SSD hardware and shock protection. His listed patent count is 1 patent.
Collaborations
Dandu’s listed coworker is Kaleb A. Wilson. The provided information does not specify their particular projects or patent collaborations.
Conclusion
Pridhvi Dandu’s listed invention focuses on protecting a solid-state drive by damping shock impulses through contact with its circuit board assembly and enclosure.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile