Boise, ID, United States of America

Bradley R Bitz

This inventor holds 18 USPTO granted patents and 8 published patent applications and 1 EPO patent, primarily in Semiconductor Packaging. Top assignee: Micron Technology Incorporated. Active years: 2012-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Bradley R Bitz. Retrieved from https://idiyas.com/inventor/bradley-r-bitz

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 18 

% Patents Active = 100.0

 

Average Co-Inventor Count = 2.9

ph-index = 3

Forward Citations = 18(Granted Patents)


Location History:

  • Bosie, ID (US) (2018)
  • Boise, ID (US) (2012 - 2023)
  • Meridian, ID (US) (2024)

Company Filing History:


Years Active: 2012-2026

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Areas of Expertise:
Printed Circuit Board
Chip-on-Wafer Processing
Thermal Management
Semiconductor Die Assemblies
Integrated Gang Bonding
Molded Underfill Structures
Cooling Channel
Electronic System Assemblies
Circuit Board Structures
Thermally Conductive Label
Optics Modules
Imager Device Packaging
18 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Bradley R Bitz

Introduction

Bradley R Bitz is a prominent inventor based in Boise, ID, known for his significant contributions to the field of circuit board technology. With a total of 14 patents to his name, Bitz has made remarkable advancements that enhance the functionality and protection of electronic components.

Latest Patents

Among his latest patents, Bitz has developed methods, systems, and devices for circuit board structures that provide component protection. This innovation allows for the implementation of memory systems on circuit boards, where multiple memory devices can be securely attached. Additionally, his designs include structures that shield these memory devices and their access components from external forces. Another notable patent involves printed wiring boards and assemblies, featuring a unique build-up lamination material that optimizes electrical coupling and enhances the overall performance of electronic systems.

Career Highlights

Bitz is currently employed at Micron Technology Incorporated, a leading company in the semiconductor industry. His work at Micron has allowed him to push the boundaries of circuit board design and functionality, contributing to the company's reputation for innovation and excellence in technology.

Collaborations

Throughout his career, Bitz has collaborated with talented individuals such as Xiao Li and Jaspreet Singh Gandhi. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Bradley R Bitz's contributions to circuit board technology exemplify the spirit of innovation. His patents not only enhance the performance of electronic devices but also demonstrate the importance of protecting sensitive components in an ever-evolving technological landscape.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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